Periannan Chidambaram

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid reconstituted substrate for electronic packaging
- Patent number 12,046,545
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
- Patent number 11,973,019
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,894,366
- Issue date Feb 6, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising an inductor and a capacitor located in an enca...
- Patent number 11,817,379
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked filters with a shared substrate cap
- Patent number 11,689,181
- Issue date Jun 27, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Artificial neural networks with precision weight for artificial int...
- Patent number 11,687,766
- Issue date Jun 27, 2023
- QUALCOMM Incorporated
- Haining Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 11,670,614
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,652,101
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with adjustable capacitance via electronic fuses
- Patent number 11,631,614
- Issue date Apr 18, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-bit compute-in-memory (CIM) arrays employing bit cell circuit...
- Patent number 11,487,507
- Issue date Nov 1, 2022
- QUALCOMM Incorporated
- Ye Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fast digital multiply-accumulate (MAC) by fast digital multiplicati...
- Patent number 11,474,786
- Issue date Oct 18, 2022
- QUALCOMM Incorporated
- Xia Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional (3D) integrated circuit device having a backside...
- Patent number 11,444,068
- Issue date Sep 13, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistors (FET) circuits employing topside and backs...
- Patent number 11,437,379
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked decoupling capacitors with integration in a substrate
- Patent number 11,417,637
- Issue date Aug 16, 2022
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compute-in-memory (CIM) binary multiplier
- Patent number 11,340,867
- Issue date May 24, 2022
- QUALCOMM Incorporated
- Xia Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Voltage regulation integrated circuit (IC) with circuit components...
- Patent number 11,320,847
- Issue date May 3, 2022
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit (IC) integration of an em...
- Patent number 11,310,911
- Issue date Apr 19, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Impedance matching transceiver
- Patent number 11,296,670
- Issue date Apr 5, 2022
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with adjustable capacitance via electronic fuses
- Patent number 11,211,290
- Issue date Dec 28, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising contact to contact coupling of packages
- Patent number 11,201,127
- Issue date Dec 14, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device coupled to a capacitor structure comprising a tre...
- Patent number 11,189,686
- Issue date Nov 30, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor interposer layer (CIL) in a die-to-wafer three-dimensiona...
- Patent number 11,158,590
- Issue date Oct 26, 2021
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor component with reduced equivalent series resistanc...
- Patent number 11,145,768
- Issue date Oct 12, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with a magnetic core
- Patent number 11,101,228
- Issue date Aug 24, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D), vertically-integrated field-effect transist...
- Patent number 10,861,852
- Issue date Dec 8, 2020
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integ...
- Patent number 10,840,884
- Issue date Nov 17, 2020
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Programmable circuits for performing machine learning operations on...
- Patent number 10,825,536
- Issue date Nov 3, 2020
- QUALCOMM Incorporated
- Haining Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High power compound semiconductor field effect transistor devices w...
- Patent number 10,756,206
- Issue date Aug 25, 2020
- QUALCOMM Incorporated
- Bin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) interconnect structure having a metal layer...
- Patent number 10,651,122
- Issue date May 12, 2020
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor field effect transistor with self-aligned gate
- Patent number 10,461,164
- Issue date Oct 29, 2019
- QUALCOMM Incorporated
- Bin Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-L...
- Publication number 20240422995
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Mustafa BADAROGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL
- Publication number 20240105728
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS
- Publication number 20240105797
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
- Publication number 20240096750
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...
- Publication number 20240038439
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...
- Publication number 20230317677
- Publication date Oct 5, 2023
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING
- Publication number 20230260947
- Publication date Aug 17, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY
- Publication number 20230246024
- Publication date Aug 3, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL POWER SPLITTER/COMBINER WITH RESISTANCE AND IMPEDANCE TRANSF...
- Publication number 20230030569
- Publication date Feb 2, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...
- Publication number 20220375851
- Publication date Nov 24, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...
- Publication number 20220344250
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY
- Publication number 20220223585
- Publication date Jul 14, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID RECONSTITUTED SUBSTRATE FOR ELECTRONIC PACKAGING
- Publication number 20220148953
- Publication date May 12, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING
- Publication number 20220108968
- Publication date Apr 7, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS (FET) CIRCUITS EMPLOYING TOPSIDE AND BACKS...
- Publication number 20220093594
- Publication date Mar 24, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES
- Publication number 20220084883
- Publication date Mar 17, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT WRAP AROUND WITH GRAPHENE
- Publication number 20220068703
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK (PDN) PROCESSING
- Publication number 20220028758
- Publication date Jan 27, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT DEVICE HAVING A BACKSIDE...
- Publication number 20220020735
- Publication date Jan 20, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EM...
- Publication number 20220022315
- Publication date Jan 20, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE COMPRISING AN INDUCTOR AND A CAPACITOR LOCATED IN AN ENC...
- Publication number 20220013444
- Publication date Jan 13, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING STACKED FILTERS WITH A SHARED SUBSTRATE CAP
- Publication number 20210376810
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BIT COMPUTE-IN-MEMORY (CIM) ARRAYS EMPLOYING BIT CELL CIRCUIT...
- Publication number 20210349689
- Publication date Nov 11, 2021
- QUALCOMM Incorporated
- Ye Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED DECOUPLING CAPACITORS WITH INTEGRATION IN A SUBSTRATE
- Publication number 20210343684
- Publication date Nov 4, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR INTERPOSER LAYER (CIL) IN A DIE-TO-WAFER THREE-DIMENSIONA...
- Publication number 20210335738
- Publication date Oct 28, 2021
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES
- Publication number 20210296170
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID THREE DIMENSIONAL INDUCTOR
- Publication number 20210281234
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTE-IN-MEMORY (CIM) BINARY MULTIPLIER
- Publication number 20210279036
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Xia LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE COMPRISING CONTACT TO CONTACT COUPLING OF PACKAGES
- Publication number 20210280540
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATION INTEGRATED CIRCUIT (IC) WITH CIRCUIT COMPONENTS...
- Publication number 20210271275
- Publication date Sep 2, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- G05 - CONTROLLING REGULATING

Periannan Chidambaram

Person

Patents Grantslast 30 patents

Hybrid reconstituted substrate for electronic packaging

Deep trench capacitors in an inter-layer medium on an interconnect...

Trench capacitor assembly for high capacitance density

Substrate comprising an inductor and a capacitor located in an enca...

Package comprising stacked filters with a shared substrate cap

Artificial neural networks with precision weight for artificial int...

Integrated circuit assembly with hybrid bonding

Trench capacitor assembly for high capacitance density

MIM capacitor with adjustable capacitance via electronic fuses

Multi-bit compute-in-memory (CIM) arrays employing bit cell circuit...

Fast digital multiply-accumulate (MAC) by fast digital multiplicati...

Three-dimensional (3D) integrated circuit device having a backside...

Field-effect transistors (FET) circuits employing topside and backs...

Stacked decoupling capacitors with integration in a substrate

Compute-in-memory (CIM) binary multiplier

Voltage regulation integrated circuit (IC) with circuit components...

Three-dimensional (3D) integrated circuit (IC) integration of an em...

Impedance matching transceiver

MIM capacitor with adjustable capacitance via electronic fuses

Device comprising contact to contact coupling of packages

Integrated device coupled to a capacitor structure comprising a tre...

Capacitor interposer layer (CIL) in a die-to-wafer three-dimensiona...

Trench capacitor component with reduced equivalent series resistanc...

Integrated circuit package with a magnetic core

Three-dimensional (3D), vertically-integrated field-effect transist...

Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integ...

Programmable circuits for performing machine learning operations on...

High power compound semiconductor field effect transistor devices w...

Integrated circuit (IC) interconnect structure having a metal layer...

Compound semiconductor field effect transistor with self-aligned gate

Patents Applicationslast 30 patents

DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-L...

TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL

TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS

SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION

INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...

INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING

TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY

SIGNAL POWER SPLITTER/COMBINER WITH RESISTANCE AND IMPEDANCE TRANSF...

DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...

TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY

HYBRID RECONSTITUTED SUBSTRATE FOR ELECTRONIC PACKAGING

INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING

FIELD-EFFECT TRANSISTORS (FET) CIRCUITS EMPLOYING TOPSIDE AND BACKS...

MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES

METAL INTERCONNECT WRAP AROUND WITH GRAPHENE

BACKSIDE POWER DISTRIBUTION NETWORK (PDN) PROCESSING

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT DEVICE HAVING A BACKSIDE...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EM...

SUBSTRATE COMPRISING AN INDUCTOR AND A CAPACITOR LOCATED IN AN ENC...

PACKAGE COMPRISING STACKED FILTERS WITH A SHARED SUBSTRATE CAP

MULTI-BIT COMPUTE-IN-MEMORY (CIM) ARRAYS EMPLOYING BIT CELL CIRCUIT...

STACKED DECOUPLING CAPACITORS WITH INTEGRATION IN A SUBSTRATE

CAPACITOR INTERPOSER LAYER (CIL) IN A DIE-TO-WAFER THREE-DIMENSIONA...

MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES

HYBRID THREE DIMENSIONAL INDUCTOR

COMPUTE-IN-MEMORY (CIM) BINARY MULTIPLIER

DEVICE COMPRISING CONTACT TO CONTACT COUPLING OF PACKAGES

VOLTAGE REGULATION INTEGRATED CIRCUIT (IC) WITH CIRCUIT COMPONENTS...