Perre KAO

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming conductive bumps for cooling device connection an...
- Patent number 11,488,891
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive bumps for cooling device connection
- Patent number 10,651,111
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive bumps for cooling device connection
- Patent number 9,899,296
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bumps for cooling device connection
- Patent number 8,941,232
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION AN...
- Publication number 20200258814
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION
- Publication number 20180166361
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMPS FOR COOLING DEVICE CONNECTION
- Publication number 20150125998
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMPS FOR COOLING DEVICE CONNECTION
- Publication number 20120217628
- Publication date Aug 30, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL WAFER RECLAMATION PROCESS
- Publication number 20110223767
- Publication date Sep 15, 2011
- Taiwan Semiconductor Manufacturing Co., LTD
- Jin-Lin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL WAFER RECLAMATION PROCESS
- Publication number 20090233447
- Publication date Sep 17, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Jin-Lin Liang
- H01 - BASIC ELECTRIC ELEMENTS