PETER A. DAVISON

Person

SUMMER, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Connector and connection assembly
- Patent number 12,018,787
- Issue date Jun 25, 2024
- Intel Corporation
- Alexis Ulmer
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Grant
Film insert molding for device manufacture
- Patent number 9,426,914
- Issue date Aug 23, 2016
- Intel Corporation
- Peter Davison
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods and devices for securing and transporting singulated die in...
- Patent number 9,305,816
- Issue date Apr 5, 2016
- Intel Corporation
- John C. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Higher performance barrier materials for containers of environmenta...
- Patent number 7,784,178
- Issue date Aug 31, 2010
- Intel Corporation
- Peter Davison
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for imprinting a circuit pattern using ultraso...
- Patent number 7,674,729
- Issue date Mar 9, 2010
- Intel Corporation
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component cooling apparatus
- Patent number 7,527,085
- Issue date May 5, 2009
- Sanyo Denki Co., Ltd.
- Masayuki Iijima
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Modular waveguide inteconnect
- Patent number 7,495,623
- Issue date Feb 24, 2009
- Gary Brist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for imprinting a circuit pattern using ultraso...
- Patent number 7,285,447
- Issue date Oct 23, 2007
- Intel Corporation
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded metal bonding tray for integrated circuit device f...
- Patent number 7,183,140
- Issue date Feb 27, 2007
- Intel Corporation
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for providing cooling systems with heat exchangers
- Patent number 6,983,789
- Issue date Jan 10, 2006
- Intel Corporation
- Kurt A. Jenkins
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System and method for providing cooling systems with heat exchangers
- Patent number 6,926,070
- Issue date Aug 9, 2005
- Intel Corporation
- Kurt A. Jenkins
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System and method for connecting a power converter to a land grid a...
- Patent number 6,884,086
- Issue date Apr 26, 2005
- Intel Corporation
- Thomas G. Ruttan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink attachment device
- Patent number 6,859,367
- Issue date Feb 22, 2005
- Intel Corporation
- Peter A. Davison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed and pressurized liquid cooling system for microprocessor
- Patent number 6,809,928
- Issue date Oct 26, 2004
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Retention mechanism for an electrical assembly
- Patent number 6,722,908
- Issue date Apr 20, 2004
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for connecting a power converter to a land grid a...
- Patent number 6,709,277
- Issue date Mar 23, 2004
- Intel Corporation
- Thomas G. Ruttan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retention mechanism for an electrical assembly
- Patent number 6,585,534
- Issue date Jul 1, 2003
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit heat sink support and retention mechanism
- Patent number 6,563,213
- Issue date May 13, 2003
- Intel Corporation
- Thomas Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection mold gate concealment by integrating surface recess and c...
- Patent number 6,560,118
- Issue date May 6, 2003
- Intel Corporation
- Michael Stark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit heat sink support and retention mechanism
- Patent number 6,529,378
- Issue date Mar 4, 2003
- Intel Corporation
- Thomas Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlocking socket base for an integrated circuit package
- Patent number 6,524,116
- Issue date Feb 25, 2003
- Intel Corporation
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection shield for an electronic cartridge
- Patent number 6,515,871
- Issue date Feb 4, 2003
- Intel Corporation
- Michael Stark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink fastener for an electronic device
- Patent number 6,496,372
- Issue date Dec 17, 2002
- Intel Corporation
- Peter A. Davison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention mechanism and electronic module mounting system
- Patent number 6,327,147
- Issue date Dec 4, 2001
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlocking socket base for an integrated circuit package
- Patent number 6,264,478
- Issue date Jul 24, 2001
- Intel Corporation
- Peter A. Davison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical latch for an electronic cartridge
- Patent number 6,208,514
- Issue date Mar 27, 2001
- Intel Corporation
- Michael Stark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retention mechanism that can be used with different electronic asse...
- Patent number 6,159,031
- Issue date Dec 12, 2000
- Intel Corporation
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink clip for an electronic assembly
- Patent number 6,101,096
- Issue date Aug 8, 2000
- Intel Corporation
- Mike MacGregor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Keyed interlock and mechanical alignment integrated mechanical rete...
- Patent number 6,030,251
- Issue date Feb 29, 2000
- Intel Corporation
- Michael Stark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover for an electronic cartridge
- Patent number 6,028,771
- Issue date Feb 22, 2000
- Intel Corporation
- Thomas Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR AND CONNECTION ASSEMBLY
- Publication number 20210324989
- Publication date Oct 21, 2021
- Intel Corporation
- Alexis ULMER
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20170032991
- Publication date Feb 2, 2017
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20160172222
- Publication date Jun 16, 2016
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20150187622
- Publication date Jul 2, 2015
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM INSERT MOLDING FOR DEVICE MANUFACTURE
- Publication number 20140022720
- Publication date Jan 23, 2014
- Peter Davison
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FULL-CONTACT RING FOR A LARGE WAFER
- Publication number 20090162183
- Publication date Jun 25, 2009
- Peter Davison
- B24 - GRINDING POLISHING
Information Patent Application
HIGHER PERFORMANCE BARRIER MATERIALS FOR CONTAINERS OF ENVIRONMENTA...
- Publication number 20090001032
- Publication date Jan 1, 2009
- Peter A. Davison
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Modular waveguide inteconnect
- Publication number 20080224936
- Publication date Sep 18, 2008
- Gary Brist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPRINTING A CIRCUIT PATTERN USING ULTRASO...
- Publication number 20080009100
- Publication date Jan 10, 2008
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Injection molded metal bonding tray for integrated circuit device f...
- Publication number 20060099788
- Publication date May 11, 2006
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for providing cooling systems with heat exchangers
- Publication number 20050183850
- Publication date Aug 25, 2005
- Intel Corporation
- Kurt A. Jenkins
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electronic component cooling apparatus
- Publication number 20050168939
- Publication date Aug 4, 2005
- Sanyo Denki Co., Ltd.
- Masayuki Iijima
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Component packaging apparatus, systems, and methods
- Publication number 20050116387
- Publication date Jun 2, 2005
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for imprinting a circuit pattern using ultraso...
- Publication number 20040266064
- Publication date Dec 30, 2004
- Peter A. Davison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK ATTACHMENT DEVICE
- Publication number 20040130876
- Publication date Jul 8, 2004
- Peter A. Davison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed and pressurized liquid cooling system for microprocessor
- Publication number 20040125561
- Publication date Jul 1, 2004
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for providing cooling systems with heat exchangers
- Publication number 20030178176
- Publication date Sep 25, 2003
- Kurt A. Jenkins
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Retention mechanism for an electrical assembly
- Publication number 20030096524
- Publication date May 22, 2003
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for connecting a power converter to a land grid a...
- Publication number 20020164894
- Publication date Nov 7, 2002
- Thomas G. Ruttan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLD GATE CONCEALMENT BY INTEGRATING SURFACE RECESS AND C...
- Publication number 20020001182
- Publication date Jan 3, 2002
- MICHAEL STARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interlocking socket base for an integrated circuit package
- Publication number 20010051449
- Publication date Dec 13, 2001
- Peter A. Davison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETENTION MECHANISM FOR AN ELECTRICAL ASSEMBLY
- Publication number 20010019913
- Publication date Sep 6, 2001
- DAVID J. LLAPITAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit heat sink support and retention mechanism
- Publication number 20010002729
- Publication date Jun 7, 2001
- Intel Corporation
- Thomas Wong
- H01 - BASIC ELECTRIC ELEMENTS

PETER A. DAVISON

Person

Patents Grantslast 30 patents

Connector and connection assembly

Film insert molding for device manufacture

Methods and devices for securing and transporting singulated die in...

Higher performance barrier materials for containers of environmenta...

Method and apparatus for imprinting a circuit pattern using ultraso...

Electronic component cooling apparatus

Modular waveguide inteconnect

Method and apparatus for imprinting a circuit pattern using ultraso...

Injection molded metal bonding tray for integrated circuit device f...

System and method for providing cooling systems with heat exchangers

System and method for providing cooling systems with heat exchangers

System and method for connecting a power converter to a land grid a...

Heat sink attachment device

Sealed and pressurized liquid cooling system for microprocessor

Retention mechanism for an electrical assembly

System and method for connecting a power converter to a land grid a...

Retention mechanism for an electrical assembly

Integrated circuit heat sink support and retention mechanism

Injection mold gate concealment by integrating surface recess and c...

Integrated circuit heat sink support and retention mechanism

Interlocking socket base for an integrated circuit package

Protection shield for an electronic cartridge

Heat sink fastener for an electronic device

Retention mechanism and electronic module mounting system

Interlocking socket base for an integrated circuit package

Mechanical latch for an electronic cartridge

Retention mechanism that can be used with different electronic asse...

Heat sink clip for an electronic assembly

Keyed interlock and mechanical alignment integrated mechanical rete...

Cover for an electronic cartridge

Patents Applicationslast 30 patents

CONNECTOR AND CONNECTION ASSEMBLY

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

FILM INSERT MOLDING FOR DEVICE MANUFACTURE

FULL-CONTACT RING FOR A LARGE WAFER

HIGHER PERFORMANCE BARRIER MATERIALS FOR CONTAINERS OF ENVIRONMENTA...

Modular waveguide inteconnect

METHOD AND APPARATUS FOR IMPRINTING A CIRCUIT PATTERN USING ULTRASO...

Injection molded metal bonding tray for integrated circuit device f...

System and method for providing cooling systems with heat exchangers

Electronic component cooling apparatus

Component packaging apparatus, systems, and methods

Method and apparatus for imprinting a circuit pattern using ultraso...

HEAT SINK ATTACHMENT DEVICE

Sealed and pressurized liquid cooling system for microprocessor

System and method for providing cooling systems with heat exchangers

Retention mechanism for an electrical assembly

System and method for connecting a power converter to a land grid a...

INJECTION MOLD GATE CONCEALMENT BY INTEGRATING SURFACE RECESS AND C...

Interlocking socket base for an integrated circuit package

RETENTION MECHANISM FOR AN ELECTRICAL ASSEMBLY

Integrated circuit heat sink support and retention mechanism