PETER BIOLSI

Person

NEW WINDSOR, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor structures using RIE process
- Patent number 8,614,150
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Peter Biolsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact processing using multi-input/multi-output (MIMO) models
- Patent number 8,532,796
- Issue date Sep 10, 2013
- Tokyo Electron Limited
- Daniel J Prager
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor structures using RIE process
- Patent number 7,442,650
- Issue date Oct 28, 2008
- International Business Machines Corporation
- Peter Biolsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel dielectric layer and metal layer sealing
- Patent number 7,214,608
- Issue date May 8, 2007
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via reactive ion etching process
- Patent number 7,045,464
- Issue date May 16, 2006
- International Business Machines Corporation
- Peter Biolsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming damascene structure utilizing planarizing materi...
- Patent number 7,030,031
- Issue date Apr 18, 2006
- International Business Machines Corporation
- William C. Wille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene structure using a sacrificial conductive layer
- Patent number 6,677,678
- Issue date Jan 13, 2004
- International Business Machines Corporation
- Peter E. Biolsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a damascene structure using a sacrificial conduct...
- Patent number 6,444,557
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Peter E. Biolsi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Etching of Polycrystalline Semiconductors
- Publication number 20230317462
- Publication date Oct 5, 2023
- TOKYO ELECTRON LIMITED
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Etching of Metal
- Publication number 20230108117
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SACRIFICIAL CAPPING LAYER FOR CONTACT ETCH
- Publication number 20220384199
- Publication date Dec 1, 2022
- TOKYO ELECTRON LIMITED
- Yun HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Processing Using Multi-Input/Multi-Output (MIMO) Models
- Publication number 20120253497
- Publication date Oct 4, 2012
- TOKYO ELECTRON LIMITED
- Daniel J. Prager
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR STRUCTURES USING RIE PROCESS
- Publication number 20090017632
- Publication date Jan 15, 2009
- International Business Machines Corporation
- PETER BIOLSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR STRUCTURES USING RIE PROCESS
- Publication number 20080166879
- Publication date Jul 10, 2008
- International Business Machines Corporation
- PETER BIOLSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA REACTIVE ION ETCHING PROCESS
- Publication number 20060105572
- Publication date May 18, 2006
- International Business Machines Corporation
- Peter Biolsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING
- Publication number 20060024961
- Publication date Feb 2, 2006
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DAMASCENE STRUCTURE UTILIZING PLANARIZING MATERI...
- Publication number 20040266201
- Publication date Dec 30, 2004
- International Business Machines Corporation
- William C. Wille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a damascene structure using a sacrificial conduct...
- Publication number 20020177301
- Publication date Nov 28, 2002
- Peter E. Biolsi
- H01 - BASIC ELECTRIC ELEMENTS

PETER BIOLSI

Person

Patents Grantslast 30 patents

Methods of manufacturing semiconductor structures using RIE process

Contact processing using multi-input/multi-output (MIMO) models

Methods of manufacturing semiconductor structures using RIE process

Interlevel dielectric layer and metal layer sealing

Via reactive ion etching process

Method for forming damascene structure utilizing planarizing materi...

Damascene structure using a sacrificial conductive layer

Method of forming a damascene structure using a sacrificial conduct...

Patents Applicationslast 30 patents

Etching of Polycrystalline Semiconductors

Method for Etching of Metal

SACRIFICIAL CAPPING LAYER FOR CONTACT ETCH

Contact Processing Using Multi-Input/Multi-Output (MIMO) Models

METHODS OF MANUFACTURING SEMICONDUCTOR STRUCTURES USING RIE PROCESS

METHODS OF MANUFACTURING SEMICONDUCTOR STRUCTURES USING RIE PROCESS

VIA REACTIVE ION ETCHING PROCESS

INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING

METHOD FOR FORMING DAMASCENE STRUCTURE UTILIZING PLANARIZING MATERI...

Method of forming a damascene structure using a sacrificial conduct...