Peter Butler

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for reducing warpage of an assembly substrate
- Patent number 5,751,556
- Issue date May 12, 1998
- Intel Corporation
- Peter O. Butler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with an integral heat sink and fan
- Patent number 5,535,094
- Issue date Jul 9, 1996
- Intel Corporation
- Daryl J. Nelson
- G06 - COMPUTING CALCULATING COUNTING