Peter DRUMMEN

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Someren, NL

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Patents Grantslast 30 patents

Information Patent Grant
Underbump metallization dimension variation with improved reliability
- Patent number 10,825,789
- Issue date Nov 3, 2020
- NXP B.V.
- Leo Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus comprising a semiconductor arrangement
- Patent number 10,613,136
- Issue date Apr 7, 2020
- NXP B.V.
- Leo Van Gemert
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS COMPRISING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20190011496
- Publication date Jan 10, 2019
- NXP B.V.
- Leo VAN GEMERT
- G01 - MEASURING TESTING