Peter G. Hartwell

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of lower profile MEMS package with stress isolations
- Patent number 9,656,856
- Issue date May 23, 2017
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Out-of plane travel restriction structures
- Patent number 9,571,008
- Issue date Feb 14, 2017
- Hewlett-Packard Development Company, L.P.
- Donald J. Milligan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light detection system including a chiral optical element and optic...
- Patent number 9,522,819
- Issue date Dec 20, 2016
- Hewlett Packard Enterprise Development LP
- David A. Fattal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of lower profile MEMS package with stress isolations
- Patent number 9,446,941
- Issue date Sep 20, 2016
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for processing an image
- Patent number 8,508,643
- Issue date Aug 13, 2013
- Hewlett-Packard Development Company, L.P.
- Janice H. Nickel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor-location system for locating a sensor in a tract covered by...
- Patent number 8,390,444
- Issue date Mar 5, 2013
- Hewlett-Packard Development Company, L.P.
- Zhiyong Li
- G01 - MEASURING TESTING
Information Patent Grant
Gyroscopes using surface electrodes
- Patent number 8,272,266
- Issue date Sep 25, 2012
- Hewlett-Packard Development Company, L.P.
- Wenhua Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Resonator having a stator coupled to three stator voltages
- Patent number 8,049,579
- Issue date Nov 1, 2011
- Hewlett-Packard Development Company, L.P.
- Robert G. Walmsley
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip cooling channels formed in wafer bonding gap
- Patent number 8,030,754
- Issue date Oct 4, 2011
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjusting the damping level of an encapsulated device
- Patent number 7,966,880
- Issue date Jun 28, 2011
- Hewlett-Packard Development Company, L.P.
- Wenhua Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Multi-die apparatus including moveable portions
- Patent number 7,808,061
- Issue date Oct 5, 2010
- Hewlett-Packard Development Company, L.P.
- Peter Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deformation-based contact lithography systems, apparatus and methods
- Patent number 7,618,752
- Issue date Nov 17, 2009
- Hewlett-Packard Development Company, L.P.
- Duncan R. Stewart
- B82 - NANO-TECHNOLOGY
Information Patent Grant
System for coupling wire to semiconductor region
- Patent number 7,521,784
- Issue date Apr 21, 2009
- Hewlett-Packard Development Company, L.P.
- Carl E. Picciotto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and systems for aligning and coupling devices
- Patent number 7,503,989
- Issue date Mar 17, 2009
- Hewlett-Packard Development Company, L.P.
- Carl E. Picciotto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for rectifying and detecting signals
- Patent number 7,429,864
- Issue date Sep 30, 2008
- Hewlett-Packard Development Company, L.P.
- Carl E. Picciotto
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for electrically coupling wires and conductors
- Patent number 7,391,090
- Issue date Jun 24, 2008
- Hewlett-Packard Development Company, L.P.
- Carl E. Picciotto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic writing systems and methods
- Patent number 7,342,575
- Issue date Mar 11, 2008
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating a sharp protrusion
- Patent number 7,118,679
- Issue date Oct 10, 2006
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- G01 - MEASURING TESTING
Information Patent Grant
Methods for electrically isolating portions of wafers
- Patent number 7,115,505
- Issue date Oct 3, 2006
- Hewlett-Packard Development Company, L.P.
- Peter George Hartwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for dicing wafer stacks to provide access to interior struc...
- Patent number 7,042,105
- Issue date May 9, 2006
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for dicing wafer stacks to provide access to interior struct...
- Patent number 6,955,976
- Issue date Oct 18, 2005
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems with high density packing of micromachines
- Patent number 6,953,704
- Issue date Oct 11, 2005
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS having a three-wafer structure
- Patent number 6,930,368
- Issue date Aug 16, 2005
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of standoffs to protect atomic resolution storage mover for out...
- Patent number 6,784,593
- Issue date Aug 31, 2004
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Use of standoffs to protect atomic resolution storage mover for out...
- Patent number 6,784,630
- Issue date Aug 31, 2004
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Use of standoffs to protect atomic resolution storage mover for out...
- Patent number 6,784,592
- Issue date Aug 31, 2004
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Systems and methods for electrically isolating portions of wafers
- Patent number 6,750,516
- Issue date Jun 15, 2004
- Hewlett-Packard Development Company, L.P.
- Peter George Hartwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device isolation process flow for ARS system
- Patent number 6,664,193
- Issue date Dec 16, 2003
- Hewlett-Packard Development Company, L.P.
- Heon Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Device isolation process flow for ARS system
- Patent number 6,621,096
- Issue date Sep 16, 2003
- Hewlett-Packard Develpoment Company, L.P.
- Heon Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Systems with high density packing of micromachines
- Patent number 6,600,201
- Issue date Jul 29, 2003
- Hewlett-Packard Development Company, L.P.
- Peter G. Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS
- Publication number 20160340175
- Publication date Nov 24, 2016
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS
- Publication number 20160167949
- Publication date Jun 16, 2016
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUT-OF-PLANE TRAVEL RESTRICTION STRUCTURES
- Publication number 20140042869
- Publication date Feb 13, 2014
- Donald J. Milligan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT-DETECTION SYSTEMS
- Publication number 20140034820
- Publication date Feb 6, 2014
- David A Fattal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method And System For Processing An Image
- Publication number 20130329108
- Publication date Dec 12, 2013
- Hewlett-Packard Development Company, L.P.
- Janice H. Nickel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE VIEWING SYSTEMS WITH DYNAMICALLY RECONFIGURABLE SCREENS FOR T...
- Publication number 20130057663
- Publication date Mar 7, 2013
- Alexandre M. Bratkovski
- G02 - OPTICS
Information Patent Application
OPTICAL SENSOR NETWORKS AND METHODS FOR FABRICATING THE SAME
- Publication number 20120281980
- Publication date Nov 8, 2012
- Hans S. Cho
- G02 - OPTICS
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING COORDINATE LOCATIONS OF SENSOR...
- Publication number 20110317154
- Publication date Dec 29, 2011
- Michael Renne Ty Tan
- G01 - MEASURING TESTING
Information Patent Application
SENSOR APPARATUS, SYSTEM AND METHOD PROVIDING COUPLING CHARACTERIZA...
- Publication number 20110303011
- Publication date Dec 15, 2011
- Kai-Mei Camilla Fu
- G01 - MEASURING TESTING
Information Patent Application
SENSOR-LOCATION SYSTEM FOR LOCATING A SENSOR IN A TRACT COVERED BY...
- Publication number 20110267171
- Publication date Nov 3, 2011
- Zhiyong LI
- G01 - MEASURING TESTING
Information Patent Application
CAPACITIVE SENSOR HAVING CYCLIC AND ABSOLUTE ELECTRODE SETS
- Publication number 20110018561
- Publication date Jan 27, 2011
- Hewlett Packard Company
- Peter George Hartwell
- G01 - MEASURING TESTING
Information Patent Application
Gyroscopes Using Surface Electrodes
- Publication number 20100257934
- Publication date Oct 14, 2010
- Hewlett-Packard Development Company, L.P.
- Wenhua Zhang
- G01 - MEASURING TESTING
Information Patent Application
RESONATOR HAVING A STATOR COUPLED TO THREE STATOR VOLTAGES
- Publication number 20100109579
- Publication date May 6, 2010
- Robert G. Walmsley
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Adjusting the Damping Level of an Encapsulated Device
- Publication number 20100089153
- Publication date Apr 15, 2010
- HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Wenhua Zhang
- G01 - MEASURING TESTING
Information Patent Application
Coupling wire to semiconductor region
- Publication number 20090152702
- Publication date Jun 18, 2009
- Carl E. Picciotto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic and optical circuit integration through wafer bonding
- Publication number 20080181558
- Publication date Jul 31, 2008
- Peter G. Hartwell
- G02 - OPTICS
Information Patent Application
Chip cooling channels formed in wafer bonding gap
- Publication number 20080179736
- Publication date Jul 31, 2008
- Peter G. Hartwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deformation-based contact lithography systems, apparatus and methods
- Publication number 20080090155
- Publication date Apr 17, 2008
- Duncan R. Stewart
- B82 - NANO-TECHNOLOGY
Information Patent Application
Multi-die apparatus including moveable portions
- Publication number 20080023813
- Publication date Jan 31, 2008
- Peter Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Smart drug delivery system and a method of implementation thereof
- Publication number 20060283465
- Publication date Dec 21, 2006
- Janice H. Nickel
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Camera motion detection system
- Publication number 20060185431
- Publication date Aug 24, 2006
- Henryk Birecki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Signal conduction for doped semiconductors
- Publication number 20060131714
- Publication date Jun 22, 2006
- Carl E. Picciotto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and systems for aligning and coupling devices
- Publication number 20060130955
- Publication date Jun 22, 2006
- Carl E. Picciotto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems and methods for rectifying and detecting signals
- Publication number 20060134869
- Publication date Jun 22, 2006
- Carl E. Picciotto
- G01 - MEASURING TESTING
Information Patent Application
Systems and methods for electrically coupling wires and conductors
- Publication number 20060131677
- Publication date Jun 22, 2006
- Carl E. Picciotto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of fabricating a sharp protrusion
- Publication number 20060021962
- Publication date Feb 2, 2006
- Peter G. Hartwell
- G01 - MEASURING TESTING
Information Patent Application
Methods for dicing wafer stacks to provide access to interior struc...
- Publication number 20050191791
- Publication date Sep 1, 2005
- Peter G. Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS having a three-wafer structure
- Publication number 20050023547
- Publication date Feb 3, 2005
- Peter G. Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems and methods for electrically isolating portions of wafers
- Publication number 20040192029
- Publication date Sep 30, 2004
- Peter George Hartwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for processing an image
- Publication number 20040141085
- Publication date Jul 22, 2004
- Janice H. Nickel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Peter G. Hartwell

Person

Patents Grantslast 30 patents

Method of lower profile MEMS package with stress isolations

Out-of plane travel restriction structures

Light detection system including a chiral optical element and optic...

Method of lower profile MEMS package with stress isolations

Method and system for processing an image

Sensor-location system for locating a sensor in a tract covered by...

Gyroscopes using surface electrodes

Resonator having a stator coupled to three stator voltages

Chip cooling channels formed in wafer bonding gap

Adjusting the damping level of an encapsulated device

Multi-die apparatus including moveable portions

Deformation-based contact lithography systems, apparatus and methods

System for coupling wire to semiconductor region

Methods and systems for aligning and coupling devices

Systems and methods for rectifying and detecting signals

Systems and methods for electrically coupling wires and conductors

Electronic writing systems and methods

Method of fabricating a sharp protrusion

Methods for electrically isolating portions of wafers

Methods for dicing wafer stacks to provide access to interior struc...

Method for dicing wafer stacks to provide access to interior struct...

Systems with high density packing of micromachines

MEMS having a three-wafer structure

Use of standoffs to protect atomic resolution storage mover for out...

Use of standoffs to protect atomic resolution storage mover for out...

Use of standoffs to protect atomic resolution storage mover for out...

Systems and methods for electrically isolating portions of wafers

Device isolation process flow for ARS system

Device isolation process flow for ARS system

Systems with high density packing of micromachines

Patents Applicationslast 30 patents

METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS

METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS

OUT-OF-PLANE TRAVEL RESTRICTION STRUCTURES

LIGHT-DETECTION SYSTEMS

Method And System For Processing An Image

IMAGE VIEWING SYSTEMS WITH DYNAMICALLY RECONFIGURABLE SCREENS FOR T...

OPTICAL SENSOR NETWORKS AND METHODS FOR FABRICATING THE SAME

SYSTEMS AND METHODS FOR DETERMINING COORDINATE LOCATIONS OF SENSOR...

SENSOR APPARATUS, SYSTEM AND METHOD PROVIDING COUPLING CHARACTERIZA...

SENSOR-LOCATION SYSTEM FOR LOCATING A SENSOR IN A TRACT COVERED BY...

CAPACITIVE SENSOR HAVING CYCLIC AND ABSOLUTE ELECTRODE SETS

Gyroscopes Using Surface Electrodes

RESONATOR HAVING A STATOR COUPLED TO THREE STATOR VOLTAGES

Adjusting the Damping Level of an Encapsulated Device

Coupling wire to semiconductor region

Electronic and optical circuit integration through wafer bonding

Chip cooling channels formed in wafer bonding gap

Deformation-based contact lithography systems, apparatus and methods

Multi-die apparatus including moveable portions

Smart drug delivery system and a method of implementation thereof

Camera motion detection system

Signal conduction for doped semiconductors

Methods and systems for aligning and coupling devices

Systems and methods for rectifying and detecting signals

Systems and methods for electrically coupling wires and conductors

Method of fabricating a sharp protrusion

Methods for dicing wafer stacks to provide access to interior struc...

MEMS having a three-wafer structure

Systems and methods for electrically isolating portions of wafers

Method and system for processing an image