Peter G. Ledermann

Person

Peekskill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packages for stacked integrated circuit chip cubes
- Patent number 5,343,366
- Issue date Aug 30, 1994
- International Business Machines Corporation
- Thomas M. Cipolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit testing system having a cantilevered contact lea...
- Patent number 5,189,363
- Issue date Feb 23, 1993
- IBM Corporation
- Mark F. Bregman
- G01 - MEASURING TESTING
Information Patent Grant
Dam for lead encapsulation
- Patent number 5,130,781
- Issue date Jul 14, 1992
- IBM Corporation
- Caroline A. Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper resistant packaging for information protection in electronic...
- Patent number 5,117,457
- Issue date May 26, 1992
- International Business Machines Corp.
- Liam D. Comerford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder placement nozzle with inert cover gas and inert gas bleed
- Patent number 5,065,932
- Issue date Nov 19, 1991
- International Business Machines Corporation
- Terry F. Hayden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder placement nozzle assembly
- Patent number 5,042,708
- Issue date Aug 27, 1991
- International Business Machines Corporation
- Peter G. Ledermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilevel integrated circuit packaging structures
- Patent number 5,028,983
- Issue date Jul 2, 1991
- International Business Machines Corporation
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with improved cooling means
- Patent number 4,970,579
- Issue date Nov 13, 1990
- International Business Machines Corp.
- Brian D. Arldt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder deposition system
- Patent number 4,934,309
- Issue date Jun 19, 1990
- International Business Machines Corporation
- Peter G. Ledermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder deposition system
- Patent number 4,898,117
- Issue date Feb 6, 1990
- International Business Machines Corporation
- Peter G. Ledermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dam for lead encapsulation
- Patent number 4,881,885
- Issue date Nov 21, 1989
- International Business Machines Corporation
- Caroline A. Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Balltape structure for tape automated bonding, multilayer packaging...
- Patent number 4,814,855
- Issue date Mar 21, 1989
- International Business Machines Corporation
- Rodney T. Hodgson
- H01 - BASIC ELECTRIC ELEMENTS

Peter G. Ledermann

Person

Patents Grantslast 30 patents

Packages for stacked integrated circuit chip cubes

Integrated circuit testing system having a cantilevered contact lea...

Dam for lead encapsulation

Tamper resistant packaging for information protection in electronic...

Solder placement nozzle with inert cover gas and inert gas bleed

Solder placement nozzle assembly

Multilevel integrated circuit packaging structures

Integrated circuit package with improved cooling means

Solder deposition system

Solder deposition system

Dam for lead encapsulation

Balltape structure for tape automated bonding, multilayer packaging...