Peter H. Aaen

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package design providing reduced electromagnetic coup...
- Patent number 10,573,594
- Issue date Feb 25, 2020
- NXP USA, INC.
- Peter H. Aaen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package design providing reduced electromagnetic coup...
- Patent number 9,312,817
- Issue date Apr 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Peter H. Aaen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package with reduced inductive coupling between adjac...
- Patent number 8,030,763
- Issue date Oct 4, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Manuel F. Romero
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods and apparatus for a reduced inductance wirebond array
- Patent number 7,683,480
- Issue date Mar 23, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Mario M. Bokatius
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE DESIGN PROVIDING REDUCED ELECTROMAGNETIC COUP...
- Publication number 20160225713
- Publication date Aug 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Peter H. Aaen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DESIGN PROVIDING REDUCED ELECTROMAGNETIC COUP...
- Publication number 20140022020
- Publication date Jan 23, 2014
- Peter H. Aaen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDUCED INDUCTIVE COUPLING BETWEEN ADJAC...
- Publication number 20090322430
- Publication date Dec 31, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Manuel F. Romero
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Methods and apparatus for a reduced inductance wirebond array
- Publication number 20070235855
- Publication date Oct 11, 2007
- Mario M. Bokatius
- H01 - BASIC ELECTRIC ELEMENTS