Peter Huang

Person

Pleasant, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Configurable capacitor
- Patent number 11,495,554
- Issue date Nov 8, 2022
- Empower Semiconductor, Inc.
- Parag Oak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-transistor bandgap reference circuit and FinFET device suited f...
- Patent number 11,150,680
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yvonne Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking structure
- Patent number 10,777,534
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-transistor bandgap reference circuit and FinFET device suited f...
- Patent number 10,534,393
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yvonne Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-transistor bandgap reference circuit and FinFET device suited f...
- Patent number 10,466,731
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yvonne Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having magnetic bonding between substrates
- Patent number 10,157,885
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 9,748,206
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONFIGURABLE CAPACITOR
- Publication number 20250048661
- Publication date Feb 6, 2025
- EMPOWER SEMICONDUCTOR, INC.
- Artin Der Minassians
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CAPACITOR
- Publication number 20230215821
- Publication date Jul 6, 2023
- Empower Semiconductor, Inc.
- Parag Oak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CAPACITOR
- Publication number 20230124931
- Publication date Apr 20, 2023
- Empower Semiconductor, Inc.
- Parag Oak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CAPACITOR
- Publication number 20210134740
- Publication date May 6, 2021
- Empower Semiconductor, Inc.
- Parag Oak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-TRANSISTOR BANDGAP REFERENCE CIRCUIT AND FINFET DEVICE SUITED F...
- Publication number 20200019201
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yvonne Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-TRANSISTOR BANDGAP REFERENCE CIRCUIT AND FINFET DEVICE SUITED F...
- Publication number 20180356852
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yvonne Lin
- G05 - CONTROLLING REGULATING
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180033773
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peter Yu-Fei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE
- Publication number 20180012868
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peter Yu Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-TRANSISTOR BANDGAP REFERENCE CIRCUIT AND FINFET DEVICE SUITED F...
- Publication number 20170212545
- Publication date Jul 27, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yvonne Lin
- H01 - BASIC ELECTRIC ELEMENTS

Peter Huang

Person

Patents Grantslast 30 patents

Configurable capacitor

Two-transistor bandgap reference circuit and FinFET device suited f...

Three-dimensional stacking structure

Two-transistor bandgap reference circuit and FinFET device suited f...

Two-transistor bandgap reference circuit and FinFET device suited f...

Package structure having magnetic bonding between substrates

Three-dimensional stacking structure and manufacturing method thereof

Patents Applicationslast 30 patents

CONFIGURABLE CAPACITOR

CONFIGURABLE CAPACITOR

CONFIGURABLE CAPACITOR

CONFIGURABLE CAPACITOR

TWO-TRANSISTOR BANDGAP REFERENCE CIRCUIT AND FINFET DEVICE SUITED F...

TWO-TRANSISTOR BANDGAP REFERENCE CIRCUIT AND FINFET DEVICE SUITED F...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

THREE-DIMENSIONAL STACKING STRUCTURE

TWO-TRANSISTOR BANDGAP REFERENCE CIRCUIT AND FINFET DEVICE SUITED F...