Peter Huebler

Person

Coswig, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a hybrid metallization layer stack f...
- Patent number 8,698,312
- Issue date Apr 15, 2014
- GLOBALFOUNDRIES Inc.
- James Werking
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer of reduced thickness for patterning a dielectric ma...
- Patent number 8,097,542
- Issue date Jan 17, 2012
- GLOBALFOUNDRIES Inc.
- Karsten Wieczorek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming embedded metal lines having increased resista...
- Patent number 8,039,395
- Issue date Oct 18, 2011
- GLOBALFOUNDRIES Inc.
- Moritz-Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric using a hard mask
- Patent number 7,416,992
- Issue date Aug 26, 2008
- Advanced Micro Devices, Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line having an increased resistance to electromigration along...
- Patent number 7,183,629
- Issue date Feb 27, 2007
- Advanced Micro Devices, Inc.
- Hans-Juergen Engelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning the surface of a substrate
- Patent number 7,063,091
- Issue date Jun 20, 2006
- Advanced Micro Devices, Inc.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCH STOP LAYER OF REDUCED THICKNESS FOR PATTERNING A DIELECTRIC MA...
- Publication number 20090218629
- Publication date Sep 3, 2009
- Karsten Wieczorek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming electrically conductive lines in an integrated ci...
- Publication number 20060267207
- Publication date Nov 30, 2006
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for forming copper-containing lines embedded in a low-k d...
- Publication number 20060267201
- Publication date Nov 30, 2006
- Peter Huebler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of patterning a low-k dielectric using a hard mask
- Publication number 20060246711
- Publication date Nov 2, 2006
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including a hybrid metallization layer stack f...
- Publication number 20050242435
- Publication date Nov 3, 2005
- James Werking
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning the surface of a substrate
- Publication number 20050230344
- Publication date Oct 20, 2005
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for forming embedded metal lines having increased resista...
- Publication number 20050161817
- Publication date Jul 28, 2005
- Moritz-Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal line having an increased resistance to electromigration along...
- Publication number 20050046031
- Publication date Mar 3, 2005
- Hans-Juergen Engelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of removing oxidized portions at an interface of a metal sur...
- Publication number 20030072695
- Publication date Apr 17, 2003
- Hartmut Ruelke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Peter Huebler

Person

Patents Grantslast 30 patents

Semiconductor device including a hybrid metallization layer stack f...

Etch stop layer of reduced thickness for patterning a dielectric ma...

Technique for forming embedded metal lines having increased resista...

Method of patterning a low-k dielectric using a hard mask

Metal line having an increased resistance to electromigration along...

Method for cleaning the surface of a substrate

Patents Applicationslast 30 patents

ETCH STOP LAYER OF REDUCED THICKNESS FOR PATTERNING A DIELECTRIC MA...

Method of forming electrically conductive lines in an integrated ci...

Technique for forming copper-containing lines embedded in a low-k d...

Method of patterning a low-k dielectric using a hard mask

Semiconductor device including a hybrid metallization layer stack f...

Method for cleaning the surface of a substrate

Technique for forming embedded metal lines having increased resista...

Metal line having an increased resistance to electromigration along...

Method of removing oxidized portions at an interface of a metal sur...