Peter J. Beckage

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon deposition over dual surface orientation substrates to prom...
- Patent number 7,754,587
- Issue date Jul 13, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a semiconductor l...
- Patent number 7,670,895
- Issue date Mar 2, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective silicon deposition for planarized dual surface orientatio...
- Patent number 7,378,306
- Issue date May 27, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting the endpoint of a chemical-mecha...
- Patent number 6,809,032
- Issue date Oct 26, 2004
- Advanced Micro Devices, Inc.
- Frank Mauersberger
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for determining CMP pad conditioner effectiveness
- Patent number 6,666,754
- Issue date Dec 23, 2003
- Advanced Micro Devices, Inc.
- Peter J. Beckage
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for detecting a process endpoint
- Patent number 6,572,443
- Issue date Jun 3, 2003
- Advanced Micro Devices Inc.
- Peter J. Beckage
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming openings for conductive interconnects
- Patent number 6,555,479
- Issue date Apr 29, 2003
- Advanced Micro Devices, Inc.
- Frederick N. Hause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for providing depth of polish feedback
- Patent number 6,514,858
- Issue date Feb 4, 2003
- Advanced Micro Devices, Inc.
- Frederick N. Hause
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming copper interconnects
- Patent number 6,489,240
- Issue date Dec 3, 2002
- Advanced Micro Devices, Inc.
- John A. Iacoponi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact each methodology and integration scheme
- Patent number 6,413,846
- Issue date Jul 2, 2002
- Advanced Micro Devices, Inc.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for determining metal CMP endpoint using integrated polis...
- Patent number 6,368,184
- Issue date Apr 9, 2002
- Advanced Micro Devices, Inc.
- Peter J. Beckage
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing slurry that reduces wafer defects and...
- Patent number 6,325,705
- Issue date Dec 4, 2001
- Advanced Micro Devices, Inc.
- Peter A. Burke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and apparatus for detecting the endpoint of a chemical-mecha...
- Patent number 6,179,688
- Issue date Jan 30, 2001
- Advanced Micro Devices, Inc.
- Peter J. Beckage
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing slurry that reduces wafer defects
- Patent number 6,168,640
- Issue date Jan 2, 2001
- Advanced Micro Devices, Inc.
- Peter A. Burke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Seasoning of a semiconductor wafer polishing pad to polish tungsten
- Patent number 6,051,495
- Issue date Apr 18, 2000
- Advanced Micro Devices, Inc.
- Peter A. Burke
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of making and using a chemical-mechanical polishing slurry...
- Patent number 5,934,978
- Issue date Aug 10, 1999
- Advanced Micro Devices, Inc.
- Peter A. Burke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Electronic device including a semiconductor layer and another layer...
- Publication number 20070246793
- Publication date Oct 25, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STI stressor integration for minimal phosphoric exposure and divot-...
- Publication number 20070249129
- Publication date Oct 25, 2007
- Freescale Semiconductor, Inc.
- Mark D. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon deposition over dual surface orientation substrates to prom...
- Publication number 20070218654
- Publication date Sep 20, 2007
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective silicon deposition for planarized dual surface orientatio...
- Publication number 20070218659
- Publication date Sep 20, 2007
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Apparatus For Detecting The Endpoint Of A Chemical-Mecha...
- Publication number 20070105247
- Publication date May 10, 2007
- Advanced Micro Devices
- Frank Mauersberger
- B24 - GRINDING POLISHING
Information Patent Application
Method of forming trench isolation in a semiconductor device
- Publication number 20060234467
- Publication date Oct 19, 2006
- Toni D. Van Gompel
- G11 - INFORMATION STORAGE
Information Patent Application
Chemical-mechanical polishing slurry that reduces wafer defects
- Publication number 20010002357
- Publication date May 31, 2001
- Peter A. Burke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Peter J. Beckage

Person

Patents Grantslast 30 patents

Silicon deposition over dual surface orientation substrates to prom...

Process of forming an electronic device including a semiconductor l...

Selective silicon deposition for planarized dual surface orientatio...

Method and apparatus for detecting the endpoint of a chemical-mecha...

Method and apparatus for determining CMP pad conditioner effectiveness

Method and apparatus for detecting a process endpoint

Method for forming openings for conductive interconnects

Test structure for providing depth of polish feedback

Method for forming copper interconnects

Contact each methodology and integration scheme

Apparatus for determining metal CMP endpoint using integrated polis...

Chemical-mechanical polishing slurry that reduces wafer defects and...

Method and apparatus for detecting the endpoint of a chemical-mecha...

Chemical-mechanical polishing slurry that reduces wafer defects

Seasoning of a semiconductor wafer polishing pad to polish tungsten

Methods of making and using a chemical-mechanical polishing slurry...

Patents Applicationslast 30 patents

Electronic device including a semiconductor layer and another layer...

STI stressor integration for minimal phosphoric exposure and divot-...

Silicon deposition over dual surface orientation substrates to prom...

Selective silicon deposition for planarized dual surface orientatio...

Method And Apparatus For Detecting The Endpoint Of A Chemical-Mecha...

Method of forming trench isolation in a semiconductor device

Chemical-mechanical polishing slurry that reduces wafer defects