Peter J. Sorce

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for forming solder bumps
- Patent number 10,879,202
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps using sacrificial layer
- Patent number 10,535,592
- Issue date Jan 14, 2020
- International Business Machines Corporation
- Eric P. Lewandowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integration of photonic, electronic, and sensor devices with SOI VL...
- Patent number 10,168,477
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Aydin Babakhani
- G02 - OPTICS
Information Patent Grant
Integration of photonic, electronic, and sensor devices with SOI VL...
- Patent number 10,168,478
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Aydin Babakhani
- G02 - OPTICS
Information Patent Grant
Integration of area efficient antennas for phased array or wafer sc...
- Patent number 10,103,450
- Issue date Oct 16, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps using sacrificial layer
- Patent number 9,953,908
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate via filling
- Patent number 9,872,394
- Issue date Jan 16, 2018
- International Business Machines Corporation
- Steven A. Cordes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of photonic, electronic, and sensor devices with SOI VL...
- Patent number 9,632,251
- Issue date Apr 25, 2017
- International Business Machines Corporation
- Aydin Babakhani
- G02 - OPTICS
Information Patent Grant
Integration of area efficient antennas for phased array or wafer sc...
- Patent number 9,472,859
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate via filling
- Patent number 9,433,101
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Steven A. Cordes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Alignment of integrated circuit chip stack
- Patent number 9,171,742
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation for integrated circuit fabrication
- Patent number 8,419,895
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Handler attachment for integrated circuit fabrication
- Patent number 8,388,782
- Issue date Mar 5, 2013
- International Business Machines Corporation
- Paul S. Andry
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structure and process for thin film interconnect
- Patent number 6,228,511
- Issue date May 8, 2001
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for thin film interconnect
- Patent number 6,165,629
- Issue date Dec 26, 2000
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film interconnect
- Patent number 5,231,751
- Issue date Aug 3, 1993
- International Business Machines Corporation
- Krishna G. Sachdev
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGULATING INDIVIDUAL CHIPS FROM WAFERS HAVING SMALL CHIPS AND SMA...
- Publication number 20220157657
- Publication date May 19, 2022
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING SOLDER BUMPS
- Publication number 20210028138
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
- Publication number 20180218970
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
- Publication number 20180218971
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF PHOTONIC, ELECTRONIC, AND SENSOR DEVICES WITH SOI VL...
- Publication number 20170192172
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Aydin Babakhani
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
- Publication number 20170125329
- Publication date May 4, 2017
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF PHOTONIC, ELECTRONIC, AND SENSOR DEVICES WITH SOI VL...
- Publication number 20170068050
- Publication date Mar 9, 2017
- International Business Machines Corporation
- Aydin Babakhani
- G02 - OPTICS
Information Patent Application
INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...
- Publication number 20160352023
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE VIA FILLING
- Publication number 20160219715
- Publication date Jul 28, 2016
- International Business Machines Corporation
- Steven A. Cordes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE VIA FILLING
- Publication number 20160113119
- Publication date Apr 21, 2016
- International Business Machines Corporation
- Steven A. Cordes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...
- Publication number 20150340765
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF PHOTONIC, ELECTRONIC, AND SENSOR DEVICES WITH SOI VL...
- Publication number 20150285998
- Publication date Oct 8, 2015
- International Business Machines Corporation
- Aydin Babakhani
- G02 - OPTICS
Information Patent Application
ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK
- Publication number 20150024549
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Handler Attachment for Integrated Circuit Fabrication
- Publication number 20110290402
- Publication date Dec 1, 2011
- International Business Machines Corporation
- Paul Andry
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Laser Ablation for Integrated Circuit Fabrication
- Publication number 20110290406
- Publication date Dec 1, 2011
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Peter J. Sorce

Person

Patents Grantslast 30 patents

System and method for forming solder bumps

Method for forming solder bumps using sacrificial layer

Integration of photonic, electronic, and sensor devices with SOI VL...

Integration of photonic, electronic, and sensor devices with SOI VL...

Integration of area efficient antennas for phased array or wafer sc...

Method for forming solder bumps using sacrificial layer

Substrate via filling

Integration of photonic, electronic, and sensor devices with SOI VL...

Integration of area efficient antennas for phased array or wafer sc...

Substrate via filling

Alignment of integrated circuit chip stack

Laser ablation for integrated circuit fabrication

Handler attachment for integrated circuit fabrication

Structure and process for thin film interconnect

Structure for thin film interconnect

Process for thin film interconnect

Patents Applicationslast 30 patents

SINGULATING INDIVIDUAL CHIPS FROM WAFERS HAVING SMALL CHIPS AND SMA...

SYSTEM AND METHOD FOR FORMING SOLDER BUMPS

METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER

METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER

INTEGRATION OF PHOTONIC, ELECTRONIC, AND SENSOR DEVICES WITH SOI VL...

METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER

INTEGRATION OF PHOTONIC, ELECTRONIC, AND SENSOR DEVICES WITH SOI VL...

INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...

SUBSTRATE VIA FILLING

SUBSTRATE VIA FILLING

INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...

INTEGRATION OF PHOTONIC, ELECTRONIC, AND SENSOR DEVICES WITH SOI VL...

ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK

Handler Attachment for Integrated Circuit Fabrication

Laser Ablation for Integrated Circuit Fabrication