Peter James Lindgren

Person

Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual-damascene process to fabricate thick wire structure
- Patent number 9,171,778
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicided trench contact to buried conductive layer
- Patent number 8,872,281
- Issue date Oct 28, 2014
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene process to fabricate thick wire structure
- Patent number 8,753,950
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid MEMS RF switch and method of fabricating same
- Patent number 8,748,207
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Peter J. Lindgren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low harmonic RF switch in SOI
- Patent number 8,722,508
- Issue date May 13, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low harmonic RF switch in SOI
- Patent number 8,674,472
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vias and high density capacitors
- Patent number 8,674,423
- Issue date Mar 18, 2014
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via including variable sidewall profile
- Patent number 8,643,190
- Issue date Feb 4, 2014
- Ultratech, Inc.
- Edward Crandal Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and design structure for high-Q value inductor and method...
- Patent number 8,645,898
- Issue date Feb 4, 2014
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer vias with dishing correction methods
- Patent number 8,631,570
- Issue date Jan 21, 2014
- International Business Machines Corporation
- Peter J. Lindgren
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hybrid MEMS RF switch and method of fabricating same
- Patent number 8,445,306
- Issue date May 21, 2013
- International Business Machines Corporation
- Peter J. Lindgren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicided trench contact to buried conductive layer
- Patent number 8,338,265
- Issue date Dec 25, 2012
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating damascene structures
- Patent number 8,293,638
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene process to fabricate thick wire structure
- Patent number 8,236,663
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wiring structure for integration with through substrate vias
- Patent number 8,234,606
- Issue date Jul 31, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and design structure for high-Q value inductor and method...
- Patent number 8,232,173
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer vias with dishing correction methods
- Patent number 8,166,651
- Issue date May 1, 2012
- International Business Machines Corporation
- Peter J. Lindgren
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Arranging through silicon vias in IC layout
- Patent number 8,136,084
- Issue date Mar 13, 2012
- International Business Machines Corporation
- Donald R. Dean, Jr.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure, design structure and method of manufacturing a structure...
- Patent number 8,125,013
- Issue date Feb 28, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating damascene structures
- Patent number 8,119,522
- Issue date Feb 21, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, design structure and method of manufacturing a structure...
- Patent number 8,101,494
- Issue date Jan 24, 2012
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line wiring structures with integrated passive elements...
- Patent number 8,089,135
- Issue date Jan 3, 2012
- International Business Machine Corporation
- Peter J. Lindgren
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through silicon via lithographic alignment and registration
- Patent number 8,039,356
- Issue date Oct 18, 2011
- International Business Machines Corporation
- Russell T. Herrin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Metal adhesion by induced surface roughness
- Patent number 8,039,314
- Issue date Oct 18, 2011
- International Business Machines Corporation
- Danielle L. DeGraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wiring structure for integration with through substrate vias
- Patent number 7,968,975
- Issue date Jun 28, 2011
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate annular via including plug filler
- Patent number 7,898,063
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Peter James Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via including variable sidewall profile
- Patent number 7,863,180
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip and design structure with through wafer vias dishing correc...
- Patent number 7,859,114
- Issue date Dec 28, 2010
- International Business Machines Corporation
- Peter J. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal tungsten through wafer via and process of fabricating same
- Patent number 7,741,226
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobal disilicide structure
- Patent number 7,696,586
- Issue date Apr 13, 2010
- International Business Machines Corporation
- David Paul Agnello
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICIDED TRENCH CONTACT TO BURIED CONDUCTIVE LAYER
- Publication number 20140239498
- Publication date Aug 28, 2014
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20140151899
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Douglas D. COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MEMS RF SWITCH AND METHOD OF FABRICATING SAME
- Publication number 20130240336
- Publication date Sep 19, 2013
- International Business Machines Corporation
- Peter J. LINDGREN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW HARMONIC RF SWITCH IN SOI
- Publication number 20130214384
- Publication date Aug 22, 2013
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND DESIGN STRUCTURE FOR HIGH-Q VALUE INDUCTOR AND METHOD...
- Publication number 20120267794
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Hanyi DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20120190164
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH WAFER VIAS WITH DISHING CORRECTION METHODS
- Publication number 20120137515
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Peter J. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DAMASCENE STRUCTURES
- Publication number 20120115303
- Publication date May 10, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid MEMS RF Switch and Method of Fabricating Same
- Publication number 20120098136
- Publication date Apr 26, 2012
- International Business Machines Corporation
- Peter J. LINDGREN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE, DESIGN STRUCTURE AND METHOD OF MANUFACTURING A STRUCTURE...
- Publication number 20120061801
- Publication date Mar 15, 2012
- International Business Machines Corporation
- David S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW HARMONIC RF SWITCH IN SOI
- Publication number 20120038024
- Publication date Feb 16, 2012
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS
- Publication number 20110185330
- Publication date Jul 28, 2011
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA LITHOGRAPHIC ALIGNMENT AND REGISTRATION
- Publication number 20110177670
- Publication date Jul 21, 2011
- International Business Machines Corporaton
- Russell T. Herrin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER
- Publication number 20110129996
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Peter James Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE
- Publication number 20110068477
- Publication date Mar 24, 2011
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGING THROUGH SILICON VIAS IN IC LAYOUT
- Publication number 20110057319
- Publication date Mar 10, 2011
- International Business Machines Corporation
- Donald R. Dean, JR.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Silicided Trench Contact to Buried Conductive Layer
- Publication number 20100117237
- Publication date May 13, 2010
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure, Design Structure and Method of Manufacturing a Structure...
- Publication number 20100041203
- Publication date Feb 18, 2010
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure, Design Structure and Method of Manufacturing a Structure...
- Publication number 20100038750
- Publication date Feb 18, 2010
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS
- Publication number 20100032809
- Publication date Feb 11, 2010
- International Business Machines Corporation
- David S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ADHESION BY INDUCED SURFACE ROUGHNESS
- Publication number 20100025825
- Publication date Feb 4, 2010
- Danielle L. DeGraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH WAFER VIAS WITH DISHING CORRECTION METHODS
- Publication number 20100029075
- Publication date Feb 4, 2010
- Peter J. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE WIRING STRUCTURES WITH INTEGRATED PASSIVE ELEMENTS...
- Publication number 20100025853
- Publication date Feb 4, 2010
- Peter J. Lindgren
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC CHIP AND DESIGN STRUCTURE WITH THROUGH WAFER VIAS DISHING CORREC...
- Publication number 20100025857
- Publication date Feb 4, 2010
- Peter J. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20100009509
- Publication date Jan 14, 2010
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMAL TUNGSTEN THROUGH WAFER VIA AND PROCESS OF FABRICATING SAME
- Publication number 20090280643
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE
- Publication number 20090278237
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER
- Publication number 20090206488
- Publication date Aug 20, 2009
- International Business Machines Corporation
- Peter James Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT DISILICIDE STRUCTURE
- Publication number 20080296706
- Publication date Dec 4, 2008
- David Paul Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF ETCHING PROCESS RESIDUAL IN SEMICONDUCTOR FABRICATION
- Publication number 20080174015
- Publication date Jul 24, 2008
- Russell Thomas Herrin
- H01 - BASIC ELECTRIC ELEMENTS

Peter James Lindgren

Person

Patents Grantslast 30 patents

Dual-damascene process to fabricate thick wire structure

Silicided trench contact to buried conductive layer

Dual-damascene process to fabricate thick wire structure

Hybrid MEMS RF switch and method of fabricating same

Low harmonic RF switch in SOI

Low harmonic RF switch in SOI

Semiconductor structure having vias and high density capacitors

Through substrate via including variable sidewall profile

Structure and design structure for high-Q value inductor and method...

Through wafer vias with dishing correction methods

Hybrid MEMS RF switch and method of fabricating same

Silicided trench contact to buried conductive layer

Method of fabricating damascene structures

Dual-damascene process to fabricate thick wire structure

Metal wiring structure for integration with through substrate vias

Structure and design structure for high-Q value inductor and method...

Through wafer vias with dishing correction methods

Arranging through silicon vias in IC layout

Structure, design structure and method of manufacturing a structure...

Method of fabricating damascene structures

Structure, design structure and method of manufacturing a structure...

Back-end-of-line wiring structures with integrated passive elements...

Through silicon via lithographic alignment and registration

Metal adhesion by induced surface roughness

Metal wiring structure for integration with through substrate vias

Through substrate annular via including plug filler

Through substrate via including variable sidewall profile

IC chip and design structure with through wafer vias dishing correc...

Optimal tungsten through wafer via and process of fabricating same

Cobal disilicide structure

Patents Applicationslast 30 patents

SILICIDED TRENCH CONTACT TO BURIED CONDUCTIVE LAYER

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

HYBRID MEMS RF SWITCH AND METHOD OF FABRICATING SAME

LOW HARMONIC RF SWITCH IN SOI

STRUCTURE AND DESIGN STRUCTURE FOR HIGH-Q VALUE INDUCTOR AND METHOD...

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

THROUGH WAFER VIAS WITH DISHING CORRECTION METHODS

METHOD OF FABRICATING DAMASCENE STRUCTURES

Hybrid MEMS RF Switch and Method of Fabricating Same

STRUCTURE, DESIGN STRUCTURE AND METHOD OF MANUFACTURING A STRUCTURE...

LOW HARMONIC RF SWITCH IN SOI

METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS

THROUGH SILICON VIA LITHOGRAPHIC ALIGNMENT AND REGISTRATION

THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER

THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE

ARRANGING THROUGH SILICON VIAS IN IC LAYOUT

Silicided Trench Contact to Buried Conductive Layer

Structure, Design Structure and Method of Manufacturing a Structure...

Structure, Design Structure and Method of Manufacturing a Structure...

METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS

METAL ADHESION BY INDUCED SURFACE ROUGHNESS

THROUGH WAFER VIAS WITH DISHING CORRECTION METHODS

BACK-END-OF-LINE WIRING STRUCTURES WITH INTEGRATED PASSIVE ELEMENTS...

IC CHIP AND DESIGN STRUCTURE WITH THROUGH WAFER VIAS DISHING CORREC...

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

OPTIMAL TUNGSTEN THROUGH WAFER VIA AND PROCESS OF FABRICATING SAME

THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE

THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER

COBALT DISILICIDE STRUCTURE

REMOVAL OF ETCHING PROCESS RESIDUAL IN SEMICONDUCTOR FABRICATION