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Peter K. MOON
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Portland, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Interconnects having sealing structures to enable selective metal c...
Patent number
9,984,922
Issue date
May 29, 2018
Intel Corporation
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnects having sealing structures to enable selective metal c...
Patent number
9,437,545
Issue date
Sep 6, 2016
Intel Corporation
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnects having sealing structures to enable selective metal c...
Patent number
8,928,125
Issue date
Jan 6, 2015
Intel Corporation
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming a copper diffusion barrier
Patent number
8,227,335
Issue date
Jul 24, 2012
Intel Corporation
Steven W. Johnston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnects having sealing structures to enable selective metal c...
Patent number
8,058,710
Issue date
Nov 15, 2011
Intel Corporation
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for an improved air gap interconnect structure
Patent number
7,629,268
Issue date
Dec 8, 2009
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for an improved air gap interconnect structure
Patent number
7,586,196
Issue date
Sep 8, 2009
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protection of seedlayer for electroplating
Patent number
7,525,196
Issue date
Apr 28, 2009
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnects having sealing structures to enable selective metal c...
Patent number
7,402,519
Issue date
Jul 22, 2008
Intel Corporation
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatuses for producing a polymer memory device
Patent number
7,326,981
Issue date
Feb 5, 2008
Intel Corporation
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for an improved air gap interconnect structure
Patent number
7,304,388
Issue date
Dec 4, 2007
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming a copper diffusion barrier
Patent number
7,279,423
Issue date
Oct 9, 2007
Intel Corporation
Steven W. Johnston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively converted inter-layer dielectric
Patent number
7,239,019
Issue date
Jul 3, 2007
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for improving selectivity of electroless metal deposition
Patent number
7,223,694
Issue date
May 29, 2007
Intel Corporation
Chin-Chang Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatuses for producing a polymer memory device
Patent number
7,078,754
Issue date
Jul 18, 2006
Intel Corporation
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of protecting a seed layer for electroplating
Patent number
7,060,617
Issue date
Jun 13, 2006
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a selectively converted inter-layer dielectric us...
Patent number
7,018,918
Issue date
Mar 28, 2006
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thick metal layer integrated process flow to improve power delivery...
Patent number
6,977,435
Issue date
Dec 20, 2005
Intel Corporation
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively converted inter-layer dielectric
Patent number
6,943,121
Issue date
Sep 13, 2005
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an air gap intermetal layer dielectric (ILD) by u...
Patent number
6,908,829
Issue date
Jun 21, 2005
Intel Corporation
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatuses for producing a polymer memory device
Patent number
6,900,063
Issue date
May 31, 2005
Intel Corporation
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under bump metallurgy for Lead-Tin bump over copper pad
Patent number
6,878,465
Issue date
Apr 12, 2005
Intel Corporation
Peter K. Moon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Removing sacrificial material by thermal decomposition
Patent number
6,833,320
Issue date
Dec 21, 2004
Intel Corporation
Robert P. Meagley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Field effect transistor
Patent number
6,707,120
Issue date
Mar 16, 2004
Intel Corporation
Payman Aminzadeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under bump metallurgy for lead-tin bump over copper pad
Patent number
6,703,069
Issue date
Mar 9, 2004
Intel Corporation
Peter K. Moon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Photoimageable material patterning techniques useful in fabricating...
Patent number
6,649,515
Issue date
Nov 18, 2003
Intel Corporation
Peter K. Moon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench isolation process using nitrogen preconditioning to reduce c...
Patent number
6,118,168
Issue date
Sep 12, 2000
Intel Corporation
Peter K. Moon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench isolation process using nitrogen preconditioning to reduce c...
Patent number
5,985,735
Issue date
Nov 16, 1999
Intel Corporation
Peter K. Moon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polysilicon polish for patterning improvement
Patent number
5,911,111
Issue date
Jun 8, 1999
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a transistor with increased hot carrier resi...
Patent number
5,827,769
Issue date
Oct 27, 1998
Intel Corporation
Payman Aminzadeh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
Publication number
20160372366
Publication date
Dec 22, 2016
Intel Corporation
Jun HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
Publication number
20150097292
Publication date
Apr 9, 2015
Intel Corporation
Jun HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
Publication number
20120007242
Publication date
Jan 12, 2012
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Protection of seedlayer for electroplating
Publication number
20090117733
Publication date
May 7, 2009
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnects having sealing structures to enable selective metal c...
Publication number
20080179748
Publication date
Jul 31, 2008
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for an improved air gap interconnect structure
Publication number
20080044999
Publication date
Feb 21, 2008
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming a copper diffusion barrier
Publication number
20070298608
Publication date
Dec 27, 2007
Steven W. Johnston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus for an improved air gap interconnect structure
Publication number
20070284744
Publication date
Dec 13, 2007
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnects having sealing structures to enable selective metal c...
Publication number
20060273431
Publication date
Dec 7, 2006
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and apparatuses for producing a polymer memory device
Publication number
20060157764
Publication date
Jul 20, 2006
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Protection of seedlayer for electroplating
Publication number
20060131750
Publication date
Jun 22, 2006
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thick metal layer integrated process flow to improve power delivery...
Publication number
20060076678
Publication date
Apr 13, 2006
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selectively converted inter-layer dielectric
Publication number
20050236714
Publication date
Oct 27, 2005
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVELY CONVERTED INTER-LAYER DIELECTRIC
Publication number
20050181593
Publication date
Aug 18, 2005
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Damascene interconnect structures
Publication number
20050146048
Publication date
Jul 7, 2005
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR PRODUCING A POLYMER MEMORY DEVICE
Publication number
20050084985
Publication date
Apr 21, 2005
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and apparatuses for producing a polymer memory device
Publication number
20050082584
Publication date
Apr 21, 2005
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thick metal layer integrated process flow to improve power delivery...
Publication number
20050051894
Publication date
Mar 10, 2005
Intel Corporation
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Removing sacrificial material by thermal decomposition
Publication number
20050042874
Publication date
Feb 24, 2005
Robert P. Meagley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for an improved air gap interconnect structure
Publication number
20040266167
Publication date
Dec 30, 2004
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for improving selectivity of electroless metal deposition
Publication number
20040253814
Publication date
Dec 16, 2004
Chin-Chang Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming electroless metal low resistivity interconnects
Publication number
20040248403
Publication date
Dec 9, 2004
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selectively converted inter-layer dielectric
Publication number
20040102032
Publication date
May 27, 2004
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming a copper diffusion barrier
Publication number
20040084773
Publication date
May 6, 2004
Steven W. Johnston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Romoving sacrificial material by thermal decomposition
Publication number
20040087060
Publication date
May 6, 2004
Robert P. Meagley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Under bump metallurgy for Lead-Tin bump over copper pad
Publication number
20040060970
Publication date
Apr 1, 2004
Peter K. Moon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of protecting a seed layer for electroplating
Publication number
20040000720
Publication date
Jan 1, 2004
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming an air gap intermetal layer dielectric (ILD) by u...
Publication number
20030168747
Publication date
Sep 11, 2003
Makarem A. Hussein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNING CONDUCTIVE LINES IN CIRCUIT STRUCTURES
Publication number
20010021581
Publication date
Sep 13, 2001
PETER K MOON
H01 - BASIC ELECTRIC ELEMENTS