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Peter Lieu
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Irvine, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Method for fabricating a neo-layer using stud bumped bare die
Patent number
8,609,473
Issue date
Dec 17, 2013
ISC8 Inc.
Peter Lieu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for depackaging prepackaged integrated circuit die and a pro...
Patent number
8,586,407
Issue date
Nov 19, 2013
ISC8 Inc.
Peter Lieu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for Fabricating a Small Footprint Chip-Scale Package and a D...
Publication number
20120211886
Publication date
Aug 23, 2012
ISC8 Inc.
Peter Lieu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Depackaging Prepackaged Integrated Circuit Die and a Pro...
Publication number
20120068341
Publication date
Mar 22, 2012
Irvine Sensors Corporation
Peter Lieu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die
Publication number
20120068336
Publication date
Mar 22, 2012
Irvine Sensors Corporation
Peter Lieu
H01 - BASIC ELECTRIC ELEMENTS