Peter Linder

Person

Sugar Land, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Secure enclave system-in-package
- Patent number 12,001,363
- Issue date Jun 4, 2024
- OCTAVO SYSTEMS LLC
- Peter Robert Linder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance module for SiP
- Patent number 11,610,844
- Issue date Mar 21, 2023
- OCTAVO SYSTEMS LLC
- Gene Alan Frantz
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method of assembling a system
- Patent number 11,502,030
- Issue date Nov 15, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component communications in system-in-package systems
- Patent number 11,416,050
- Issue date Aug 16, 2022
- OCTAVO SYSTEMS LLC
- Kevin Michael Troy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Analog memory cells with valid flag
- Patent number 11,373,720
- Issue date Jun 28, 2022
- OCTAVO SYSTEMS LLC
- Peter Linder
- G11 - INFORMATION STORAGE
Information Patent Grant
Analog arithmetic unit
- Patent number 11,347,478
- Issue date May 31, 2022
- OCTAVO SYSTEMS LLC
- Erik James Welsh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
EMI shield for molded packages
- Patent number 11,302,648
- Issue date Apr 12, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed signal computer
- Patent number 11,171,651
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Laurence Ray Simar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Utilization of a proxy technique in escrow encryption key usage
- Patent number 11,057,198
- Issue date Jul 6, 2021
- Assured Enterprises, Inc.
- Peter Robert Linder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
EMI shield for molded packages
- Patent number 10,714,430
- Issue date Jul 14, 2020
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of passive components in system-in-package devices
- Patent number 10,470,294
- Issue date Nov 5, 2019
- Octavo Systems LLC
- Erik James Welsh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal termination scheme for high speed memory modules
- Patent number 7,843,213
- Issue date Nov 30, 2010
- Nanya Technology Corp.
- Peter Linder
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SECURE ENCLAVE SYSTEM-IN-PACKAGE
- Publication number 20240289290
- Publication date Aug 29, 2024
- Octavo Systems LLC
- Peter Robert LINDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SECURE ENCLAVE SYSTEM-IN-PACKAGE
- Publication number 20230185748
- Publication date Jun 15, 2023
- Octavo Systems LLC
- Peter Robert LINDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
- Publication number 20220390970
- Publication date Dec 8, 2022
- Octavo Systems LLC
- Kevin Michael Troy
- G05 - CONTROLLING REGULATING
Information Patent Application
ANALOG ARITHMETIC UNIT
- Publication number 20210072958
- Publication date Mar 11, 2021
- Octavo Systems LLC
- Erik James WELSH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MIXED SIGNAL COMPUTER
- Publication number 20200403618
- Publication date Dec 24, 2020
- Octavo Systems LLC
- Laurence Ray SIMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANALOG MEMORY CELLS WITH VALID FLAG
- Publication number 20200402601
- Publication date Dec 24, 2020
- Octavo Systems LLC
- Peter LINDER
- G11 - INFORMATION STORAGE
Information Patent Application
EMI SHIELD FOR MOLDED PACKAGES
- Publication number 20200303321
- Publication date Sep 24, 2020
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MODULE FOR SIP
- Publication number 20200243451
- Publication date Jul 30, 2020
- Octavo Systems LLC
- Gene Alan FRANTZ
- G11 - INFORMATION STORAGE
Information Patent Application
SUBSTRATE FOR USE IN SYSTEM IN A PACKAGE (SIP) DEVICES
- Publication number 20190206779
- Publication date Jul 4, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMI SHIELD FOR MOLDED PACKAGES
- Publication number 20190027443
- Publication date Jan 24, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
- Publication number 20180321313
- Publication date Nov 8, 2018
- Octavo Systems LLC
- Kevin Michael Troy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
REDUCTION OF PASSIVE COMPONENTS IN SYSTEM-IN-PACKAGE DEVICES
- Publication number 20180317316
- Publication date Nov 1, 2018
- Octavo Systems LLC
- Erik James Welsh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Utilization of a Proxy Technique in Escrow Encryption Key Usage
- Publication number 20180254891
- Publication date Sep 6, 2018
- Assured Enterprises, Inc.
- Peter Robert Linder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Signal Termination Scheme for High Speed Memory Modules
- Publication number 20100299468
- Publication date Nov 25, 2010
- Peter Linder
- G06 - COMPUTING CALCULATING COUNTING

Peter Linder

Person

Patents Grantslast 30 patents

Secure enclave system-in-package

High performance module for SiP

System and method of assembling a system

Component communications in system-in-package systems

Analog memory cells with valid flag

Analog arithmetic unit

EMI shield for molded packages

Mixed signal computer

Utilization of a proxy technique in escrow encryption key usage

EMI shield for molded packages

Reduction of passive components in system-in-package devices

Signal termination scheme for high speed memory modules

Patents Applicationslast 30 patents

SECURE ENCLAVE SYSTEM-IN-PACKAGE

SECURE ENCLAVE SYSTEM-IN-PACKAGE

COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS

ANALOG ARITHMETIC UNIT

MIXED SIGNAL COMPUTER

ANALOG MEMORY CELLS WITH VALID FLAG

EMI SHIELD FOR MOLDED PACKAGES

HIGH PERFORMANCE MODULE FOR SIP

SUBSTRATE FOR USE IN SYSTEM IN A PACKAGE (SIP) DEVICES

EMI SHIELD FOR MOLDED PACKAGES

COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS

REDUCTION OF PASSIVE COMPONENTS IN SYSTEM-IN-PACKAGE DEVICES

Utilization of a Proxy Technique in Escrow Encryption Key Usage

Signal Termination Scheme for High Speed Memory Modules