Peter M. Martino

Person

Derry, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Damping vibrations within storage device testing systems
- Patent number 9,779,780
- Issue date Oct 3, 2017
- Teradyne, Inc.
- Peter Martino
- G11 - INFORMATION STORAGE
Information Patent Grant
Isolating an excitation-sensitive component by elastic wave reflection
- Patent number 8,102,620
- Issue date Jan 24, 2012
- Seagate Technology LLC
- Peter Miguel Martino
- G11 - INFORMATION STORAGE
Information Patent Grant
Monitoring gas leakage rates from hermetically sealed devices
- Patent number 8,074,491
- Issue date Dec 13, 2011
- Seagate Technology LLC
- Peter Miguel Martino
- G01 - MEASURING TESTING
Information Patent Grant
Thermode sealing with magnetic field compensation
- Patent number 7,886,802
- Issue date Feb 15, 2011
- Maxtor Corporation
- Peter M. Martino
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor assembly and spring member therefor
- Patent number 6,977,434
- Issue date Dec 20, 2005
- Hewlett-Packard Development Company, L.P.
- Peter Miguel Martino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for liquid spill containment
- Patent number 5,297,992
- Issue date Mar 29, 1994
- Digital Equipment Corporation
- Douglas A. Bailey
- F24 - HEATING RANGES VENTILATING

Patents Applicationslast 30 patents

Information Patent Application
DAMPING VIBRATIONS WITHIN STORAGE DEVICE TESTING SYSTEMS
- Publication number 20110310724
- Publication date Dec 22, 2011
- Teradyne, Inc.
- Peter Martino
- G11 - INFORMATION STORAGE
Information Patent Application
Management Of Air-Borne Vibration
- Publication number 20110305132
- Publication date Dec 15, 2011
- Teradyne, Inc.
- Brian S. Merrow
- G11 - INFORMATION STORAGE
Information Patent Application
CHANGING THE COMPOSITION AND/OR DENSITY OF GASES INSIDE OF ASSEMBLI...
- Publication number 20110261483
- Publication date Oct 27, 2011
- Philip Campbell
- G11 - INFORMATION STORAGE
Information Patent Application
Elastic Wave Reflection
- Publication number 20100322054
- Publication date Dec 23, 2010
- Seagate Technology LLC
- Peter Miguel Martino
- G11 - INFORMATION STORAGE
Information Patent Application
Monitoring Gas Leakage Rates From Hermetically Sealed Devices
- Publication number 20100199748
- Publication date Aug 12, 2010
- Seagate Technology LLC
- Peter Miguel Martino
- G01 - MEASURING TESTING
Information Patent Application
Thermode sealing with magnetic field compensation
- Publication number 20070240820
- Publication date Oct 18, 2007
- Maxtor Corporation
- Peter M. Martino
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor assembly and spring member therefor
- Publication number 20050082665
- Publication date Apr 21, 2005
- Peter Miguel Martino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for mounting processor and heat transfer mechanism
- Publication number 20050068741
- Publication date Mar 31, 2005
- Douglas A. Bailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate reinforcing in an LGA package
- Publication number 20050047106
- Publication date Mar 3, 2005
- Peter Miguel Martino
- H01 - BASIC ELECTRIC ELEMENTS

Peter M. Martino

Person

Patents Grantslast 30 patents

Damping vibrations within storage device testing systems

Isolating an excitation-sensitive component by elastic wave reflection

Monitoring gas leakage rates from hermetically sealed devices

Thermode sealing with magnetic field compensation

Semiconductor assembly and spring member therefor

Method and apparatus for liquid spill containment

Patents Applicationslast 30 patents

DAMPING VIBRATIONS WITHIN STORAGE DEVICE TESTING SYSTEMS

Management Of Air-Borne Vibration

CHANGING THE COMPOSITION AND/OR DENSITY OF GASES INSIDE OF ASSEMBLI...

Elastic Wave Reflection

Monitoring Gas Leakage Rates From Hermetically Sealed Devices

Thermode sealing with magnetic field compensation

Semiconductor assembly and spring member therefor

System and method for mounting processor and heat transfer mechanism

Substrate reinforcing in an LGA package