Peter McNally

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Saratoga, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a die and through-substrate via
- Patent number 9,659,900
- Issue date May 23, 2017
- Maxim Intergrated Products, Inc.
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a die and through substrate-via
- Patent number 9,196,587
- Issue date Nov 24, 2015
- Maxim Integrated Products, Inc.
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DIE AND THROUGH-SUBSTRATE VIA
- Publication number 20160079197
- Publication date Mar 17, 2016
- Maxim Integrated Products, Inc.
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DIE AND THROUGH SUBSTRATE-VIA
- Publication number 20140264844
- Publication date Sep 18, 2014
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS