Peter S. Locke

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Void-free damascene copper deposition process and means of monitori...
- Patent number 7,678,258
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Early detection of contact liner integrity by chemical reaction
- Patent number 7,078,247
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Lawrence Bauer, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plating copper conductors and devices formed
- Patent number 6,979,393
- Issue date Dec 27, 2005
- International Business Machines Corporation
- Kenneth P. Rodbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for depositing metal films onto substrate surfaces utilizing...
- Patent number 6,660,330
- Issue date Dec 9, 2003
- International Business Machines Corporation
- Peter S. Locke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating apparatus with vertical electrical contact
- Patent number 6,627,052
- Issue date Sep 30, 2003
- International Business Machines Corporation
- James Edward Fluegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seedlayer for plating metal in deep submicron structures
- Patent number 6,600,230
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling additives in copper plating baths
- Patent number 6,592,747
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Wilma Jean Horkans
- G01 - MEASURING TESTING
Information Patent Grant
Method of controlling chemical bath composition in a manufacturing...
- Patent number 6,471,845
- Issue date Oct 29, 2002
- International Business Machines Corporation
- John O. Dukovic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method to build multi level structure
- Patent number 6,413,854
- Issue date Jul 2, 2002
- International Business Machines Corp.
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective plating process
- Patent number 6,368,484
- Issue date Apr 9, 2002
- International Business Machines Corporation
- Richard P. Volant
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pattern-sensitive electrolytic metal plating
- Patent number 6,344,125
- Issue date Feb 5, 2002
- International Business Machines Corporation
- Peter S. Locke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for plating copper conductors and devices formed
- Patent number 6,344,129
- Issue date Feb 5, 2002
- International Business Machines Corporation
- Kenneth P. Rodbell
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for controlling the texture and microstructure of plated cop...
- Patent number 6,333,120
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Patrick William DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of improving contact reliability for electroplating
- Patent number 6,331,237
- Issue date Dec 18, 2001
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and method using a compressible contact
- Patent number 6,270,646
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Erick Gregory Walton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method to produce high quality metal fill in deep submicron vias an...
- Patent number 6,258,717
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Void-free damascene copper deposition process and means of monitori...
- Publication number 20050006242
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EARLY DETECTION OF CONTACT LINER INTEGRITY BY CHEMICAL REACTION
- Publication number 20050010455
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Lawrence Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of controlling additives in copper plating baths
- Publication number 20030000850
- Publication date Jan 2, 2003
- Wilma Jean Horkans
- G01 - MEASURING TESTING
Information Patent Application
Deformation-susceptible substrate holder for low-pressure MOCVD and...
- Publication number 20020146903
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Peter S. Locke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroplating apparatus with vertical electrical contact
- Publication number 20020108862
- Publication date Aug 15, 2002
- James Edward Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless metal liner formation methods
- Publication number 20020081842
- Publication date Jun 27, 2002
- Carlos J. Sambucetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for plating copper conductors and devices formed
- Publication number 20020066673
- Publication date Jun 6, 2002
- International Business Machines Corporation
- Kenneth P. Rodbell
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of improving contact reliability for electroplating
- Publication number 20020027082
- Publication date Mar 7, 2002
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method to produce high quality metal fill in deep submicron vias an...
- Publication number 20010046565
- Publication date Nov 29, 2001
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Peter S. Locke

Person

Patents Grantslast 30 patents

Void-free damascene copper deposition process and means of monitori...

Electroplated copper interconnection structure, process for making...

Early detection of contact liner integrity by chemical reaction

Method for plating copper conductors and devices formed

Method for depositing metal films onto substrate surfaces utilizing...

Electroplating apparatus with vertical electrical contact

Seedlayer for plating metal in deep submicron structures

Method of controlling additives in copper plating baths

Method of controlling chemical bath composition in a manufacturing...

Method to build multi level structure

Selective plating process

Pattern-sensitive electrolytic metal plating

Method for plating copper conductors and devices formed

Method for controlling the texture and microstructure of plated cop...

Method of improving contact reliability for electroplating

Electroplating apparatus and method using a compressible contact

Method to produce high quality metal fill in deep submicron vias an...

Patents Applicationslast 30 patents

Void-free damascene copper deposition process and means of monitori...

EARLY DETECTION OF CONTACT LINER INTEGRITY BY CHEMICAL REACTION

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...

Method of controlling additives in copper plating baths

Deformation-susceptible substrate holder for low-pressure MOCVD and...

Electroplating apparatus with vertical electrical contact

Electroless metal liner formation methods

Method for plating copper conductors and devices formed

Method of improving contact reliability for electroplating

Method to produce high quality metal fill in deep submicron vias an...