Peter Scherl

Person

Neunburg v. W., DE

People

Patents Grantslast 30 patents

Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising substrate, semiconductor chip...
- Patent number 11,631,628
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising a leadframe connected to a su...
- Patent number 11,037,856
- Issue date Jun 15, 2021
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 10,566,309
- Issue date Feb 18, 2020
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bondpad and bondpad
- Patent number 9,780,053
- Issue date Oct 3, 2017
- Infineon Technologies AG
- Magdalena Hoier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart card module arrangement
- Patent number 9,633,303
- Issue date Apr 25, 2017
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,355,984
- Issue date May 31, 2016
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and a method for manufacturing a chip arrangement
- Patent number 9,224,695
- Issue date Dec 29, 2015
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Smart card module for a smart card
- Patent number 9,141,902
- Issue date Sep 22, 2015
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cover structure with integrated chip and antenna
- Patent number 8,684,273
- Issue date Apr 1, 2014
- Infineon Technologies AG
- Peter Scherl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transponder inlay with antenna breaking layer for a document for pe...
- Patent number 8,640,961
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Matthias Gruenauer
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Document for personal identification having protection against exte...
- Patent number 8,272,574
- Issue date Sep 25, 2012
- Infineon Technologies AG
- Matthias Gruenauer
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH POWER ELECTRONICS CARRIER HAVING TRENCH...
- Publication number 20230245968
- Publication date Aug 3, 2023
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...
- Publication number 20230223312
- Publication date Jul 13, 2023
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STOP FEATURE FOR ELECTRONIC DEVICES
- Publication number 20230170316
- Publication date Jun 1, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...
- Publication number 20210193556
- Publication date Jun 24, 2021
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat Lead Package Formation Method
- Publication number 20210043603
- Publication date Feb 11, 2021
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...
- Publication number 20200251400
- Publication date Aug 6, 2020
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20200203310
- Publication date Jun 25, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...
- Publication number 20190103342
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20180096966
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Fabricating an Electronic Device
- Publication number 20150124420
- Publication date May 7, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20150021792
- Publication date Jan 22, 2015
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART CARD MODULE ARRANGEMENT
- Publication number 20140263663
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140239474
- Publication date Aug 28, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Housing for Smart Cards
- Publication number 20140091450
- Publication date Apr 3, 2014
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Smart Card Module for a Smart Card
- Publication number 20130082112
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COVER STRUCTURE WITH INTEGRATED CHIP AND ANTENNA
- Publication number 20130075478
- Publication date Mar 28, 2013
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSPONDER INLAY FOR A DOCUMENT FOR PERSONAL IDENTIFICATION, AND A...
- Publication number 20120074228
- Publication date Mar 29, 2012
- INFINEON TECHNOLOGIES AG
- Matthias Gruenauer
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Application
DOCUMENT FOR PERSONAL IDENTIFICATION AND A METHOD FOR PRODUCING A D...
- Publication number 20100084474
- Publication date Apr 8, 2010
- INFINEON TECHNOLOGIES AG
- Matthias Gruenauer
- G06 - COMPUTING CALCULATING COUNTING

Peter Scherl

Person

Patents Grantslast 30 patents

Flat lead package formation method

Semiconductor chip package comprising substrate, semiconductor chip...

Multi-purpose non-linear semiconductor package assembly line

Semiconductor chip package comprising a leadframe connected to a su...

Multi-purpose non-linear semiconductor package assembly line

Method of forming a bondpad and bondpad

Electronic device and method of fabricating an electronic device

Smart card module arrangement

Electronic device and method for fabricating an electronic device

Chip arrangement and a method for manufacturing a chip arrangement

Smart card module for a smart card

Cover structure with integrated chip and antenna

Transponder inlay with antenna breaking layer for a document for pe...

Document for personal identification having protection against exte...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH POWER ELECTRONICS CARRIER HAVING TRENCH...

SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...

SOLDER STOP FEATURE FOR ELECTRONIC DEVICES

SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...

Flat Lead Package Formation Method

SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

Electronic Device and Method of Fabricating an Electronic Device

ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE

SMART CARD MODULE ARRANGEMENT

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

Semiconductor Housing for Smart Cards

Smart Card Module for a Smart Card

COVER STRUCTURE WITH INTEGRATED CHIP AND ANTENNA

TRANSPONDER INLAY FOR A DOCUMENT FOR PERSONAL IDENTIFICATION, AND A...

DOCUMENT FOR PERSONAL IDENTIFICATION AND A METHOD FOR PRODUCING A D...