Peter Strobel

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Package with separate substrate sections
- Patent number 11,710,684
- Issue date Jul 25, 2023
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of one or more carrier bodies and electronic components...
- Patent number 11,502,042
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 11,296,015
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,832,992
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch process for connecting chips to a carrier
- Patent number 9,673,170
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Rupert Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method of manufacturing the same
- Patent number 9,349,680
- Issue date May 24, 2016
- Infineon Technologies Austria AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigured wafer alignment
- Patent number 7,943,423
- Issue date May 17, 2011
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic housing and semiconductor component with said plastic housing
- Patent number 7,919,857
- Issue date Apr 5, 2011
- Infineon Technologies AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
External contact material for external contacts of a semiconductor...
- Patent number 7,893,532
- Issue date Feb 22, 2011
- Infineon Technologies AG
- Michael Bauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,772,105
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a thinned semiconductor chip and method f...
- Patent number 7,749,864
- Issue date Jul 6, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor component and panel used for the production thereof
- Patent number 7,700,956
- Issue date Apr 20, 2010
- Infineon Technologies AG
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic circuit in a package-on-package configuration and method...
- Patent number 7,662,664
- Issue date Feb 16, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and method for the production thereof
- Patent number 7,602,614
- Issue date Oct 13, 2009
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a structure of joining material to the back sur...
- Patent number 7,592,236
- Issue date Sep 22, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart card, smart card module, and a method for production of a sma...
- Patent number 7,575,173
- Issue date Aug 18, 2009
- Infineon Technologies, AG
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for coating a structure comprising semiconductor chips
- Patent number 7,547,645
- Issue date Jun 16, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and a panel
- Patent number 7,524,699
- Issue date Apr 28, 2009
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor chip and adhesive film and...
- Patent number 7,470,601
- Issue date Dec 30, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor wafer, and method for produc...
- Patent number 7,420,262
- Issue date Sep 2, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module having plug contacts and method for producing it
- Patent number 7,391,103
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,327,023
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a thinned semiconductor chip and method f...
- Patent number 7,294,916
- Issue date Nov 13, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, panel having electronic modules which are to be...
- Patent number 7,276,785
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH SEPARATE SUBSTRATE SECTIONS
- Publication number 20210111108
- Publication date Apr 15, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20210013132
- Publication date Jan 14, 2021
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...
- Publication number 20210005557
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Supporting Thin Semiconductor Chips with a...
- Publication number 20200395334
- Publication date Dec 17, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20180040530
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Process for Connecting Chips to a Carrier
- Publication number 20160043054
- Publication date Feb 11, 2016
- INFINEON TECHNOLOGIES AG
- Rupert Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip arrangement and method of manufacturing the same
- Publication number 20150194377
- Publication date Jul 9, 2015
- Infineon Technologies Austria AG
- Joachim MAHLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURED WAFER ALIGNMENT
- Publication number 20100233831
- Publication date Sep 16, 2010
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING AN ADHESIVE LAYER ON THIN CUT SEMICONDUCTOR CHI...
- Publication number 20100051190
- Publication date Mar 4, 2010
- QIMONDA AG
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...
- Publication number 20080242057
- Publication date Oct 2, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with Plastic Housing, and Process for Produ...
- Publication number 20080050907
- Publication date Feb 28, 2008
- INFINEON TECHNOLOGIES AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic Housing and Semiconductor Component with Said Plastic Housi...
- Publication number 20080045063
- Publication date Feb 21, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Application
Electronic Circuit in a Package-On-Package Configuration and Method...
- Publication number 20080017967
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor component and panel used for the production thereof
- Publication number 20070128754
- Publication date Jun 7, 2007
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for coating a structure comprising semiconductor chips
- Publication number 20070105394
- Publication date May 10, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for applying a structure of joining material to the back sur...
- Publication number 20070087532
- Publication date Apr 19, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with semiconductor chip and adhesive film and...
- Publication number 20070082463
- Publication date Apr 12, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
External contact material for external contacts of a semiconductor...
- Publication number 20070057372
- Publication date Mar 15, 2007
- Michael Bauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...
- Publication number 20070042568
- Publication date Feb 22, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Smart card, smart card module, and a method for production of a sma...
- Publication number 20060175419
- Publication date Aug 10, 2006
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic component and panel for producing the same
- Publication number 20060125042
- Publication date Jun 15, 2006
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with plastic housing, and process for produ...
- Publication number 20060076667
- Publication date Apr 13, 2006
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module having plug contacts and method for producing it
- Publication number 20050087851
- Publication date Apr 28, 2005
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module, panel having electronic modules which are to be...
- Publication number 20050052830
- Publication date Mar 10, 2005
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and semiconductor wafer, and method for produc...
- Publication number 20040207049
- Publication date Oct 21, 2004
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Peter Strobel

Person

Patents Grantslast 30 patents

Package with separate substrate sections

Processing of one or more carrier bodies and electronic components...

Die attach methods and semiconductor devices manufactured based on...

Die attach methods and semiconductor devices manufactured based on...

Die attach methods and semiconductor devices manufactured based on...

Batch process for connecting chips to a carrier

Chip arrangement and method of manufacturing the same

Reconfigured wafer alignment

Plastic housing and semiconductor component with said plastic housing

External contact material for external contacts of a semiconductor...

Semiconductor component with plastic housing, and process for produ...

Semiconductor device with a thinned semiconductor chip and method f...

Sensor component and panel used for the production thereof

Electronic circuit in a package-on-package configuration and method...

Electronic module and method for the production thereof

Method for applying a structure of joining material to the back sur...

Smart card, smart card module, and a method for production of a sma...

Method for coating a structure comprising semiconductor chips

Electronic component and a panel

Semiconductor device with semiconductor chip and adhesive film and...

Electronic component and semiconductor wafer, and method for produc...

Electronic module having plug contacts and method for producing it

Semiconductor component with plastic housing, and process for produ...

Semiconductor device with a thinned semiconductor chip and method f...

Electronic module, panel having electronic modules which are to be...

Patents Applicationslast 30 patents

PACKAGE WITH SEPARATE SUBSTRATE SECTIONS

Die Attach Methods and Semiconductor Devices Manufactured based on...

PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...

Method and Structure for Supporting Thin Semiconductor Chips with a...

Die Attach Methods and Semiconductor Devices Manufactured based on...

Die Attach Methods and Semiconductor Devices Manufactured based on...

Batch Process for Connecting Chips to a Carrier

Chip arrangement and method of manufacturing the same

RECONFIGURED WAFER ALIGNMENT

METHOD FOR APPLYING AN ADHESIVE LAYER ON THIN CUT SEMICONDUCTOR CHI...

SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...

Semiconductor Component with Plastic Housing, and Process for Produ...

Plastic Housing and Semiconductor Component with Said Plastic Housi...

Electronic Circuit in a Package-On-Package Configuration and Method...

Sensor component and panel used for the production thereof

Method for coating a structure comprising semiconductor chips

Method for applying a structure of joining material to the back sur...

Semiconductor device with semiconductor chip and adhesive film and...

External contact material for external contacts of a semiconductor...

SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...

Smart card, smart card module, and a method for production of a sma...

Electronic component and panel for producing the same

Semiconductor component with plastic housing, and process for produ...

Electronic module having plug contacts and method for producing it

Electronic module, panel having electronic modules which are to be...

Electronic component and semiconductor wafer, and method for produc...