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Peter W. Farrell
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Lunenberg, MA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stress mitigation in packaged microchips
Patent number
8,344,487
Issue date
Jan 1, 2013
Analog Devices, Inc.
Xin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microchip with premolded-type package
Patent number
7,166,911
Issue date
Jan 23, 2007
Analog Devices, Inc.
Maurice S. Karpman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS capping method and apparatus
Patent number
6,893,574
Issue date
May 17, 2005
Lawrence E. Felton
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hermetically sealed dies and die attach materials
Patent number
5,736,607
Issue date
Apr 7, 1998
Analog Devices, Inc.
John R. Martin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Stress Mitigation in Packaged Microchips
Publication number
20100013067
Publication date
Jan 21, 2010
Analog Devices, Inc.
Xin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Mitigation in Packaged Microchips
Publication number
20090230521
Publication date
Sep 17, 2009
Analog Devices, Inc.
Xin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Mitigation in Packaged Microchips
Publication number
20080157298
Publication date
Jul 3, 2008
Analog Devices, Inc.
Xin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress sensitive microchip with premolded-type package
Publication number
20050056870
Publication date
Mar 17, 2005
Maurice S. Karpman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Packaged microchip with premolded-type package
Publication number
20050035446
Publication date
Feb 17, 2005
Maurice S. Karpman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS capping method and apparatus
Publication number
20030075794
Publication date
Apr 24, 2003
Lawrence E. Felton
B81 - MICRO-STRUCTURAL TECHNOLOGY