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PETER W. HEY
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SAN JOSE, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electro-chemical deposition system
Patent number
7,497,932
Issue date
Mar 3, 2009
Applied Materials, Inc.
Yezdi Dordi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of conditioning electrochemical baths in plating technology
Patent number
6,893,548
Issue date
May 17, 2005
Applied Materials Inc.
Robin Cheung
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method and apparatus to overcome anomalies in copper seed layers an...
Patent number
6,808,612
Issue date
Oct 26, 2004
Applied Materials, Inc.
Peter Hey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electro-chemical deposition system
Patent number
6,635,157
Issue date
Oct 21, 2003
Applied Materials, Inc.
Yezdi Dordi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Gas inlets for wafer processing chamber
Patent number
6,500,734
Issue date
Dec 31, 2002
Applied Materials, Inc.
Roger N. Anderson
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Apparatus with etchant mixing assembly for removal of unwanted elec...
Patent number
6,494,219
Issue date
Dec 17, 2002
Applied Materials, Inc.
Radha Nayak
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for achieving copper fill of high aspect ratio interconnect...
Patent number
6,436,267
Issue date
Aug 20, 2002
Applied Materials, Inc.
Daniel A. Carl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electro-chemical deposition system
Patent number
6,258,220
Issue date
Jul 10, 2001
Applied Materials, Inc.
Yezdi Dordi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
In-situ electroless copper seed layer enhancement in an electroplat...
Patent number
6,258,223
Issue date
Jul 10, 2001
Applied Materials, Inc.
Robin Cheung
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Gas inlets for wafer processing chamber
Patent number
5,916,369
Issue date
Jun 29, 1999
Applied Materials, Inc.
Roger N. Anderson
C30 - CRYSTAL GROWTH
Patents Applications
last 30 patents
Information
Patent Application
Electro-chemical deposition system
Publication number
20060246690
Publication date
Nov 2, 2006
APPLIED MATERIALS, INC.
Yezdi Dordi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Small volume electroplating cell
Publication number
20040104119
Publication date
Jun 3, 2004
APPLIED MATERIALS, INC.
Sergio Edelstein
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Electro-chemical deposition system
Publication number
20040084301
Publication date
May 6, 2004
APPLIED MATERIALS, INC.
Yezdi Dordi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for removal of unwanted electroplating deposits
Publication number
20030038107
Publication date
Feb 27, 2003
APPLIED MATERIALS, INC.
Radha Nayak
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method for achieving copper fill of high aspect ratio interconnect...
Publication number
20030000844
Publication date
Jan 2, 2003
APPLIED MATERIALS, INC.
Daniel A. Carl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for patching electrochemically deposited layer...
Publication number
20020043466
Publication date
Apr 18, 2002
APPLIED MATERIALS, INC.
Yezdi N. Dordi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method and apparatus for conditioning electrochemical baths in plat...
Publication number
20020033340
Publication date
Mar 21, 2002
Robin Cheung
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Electro-chemical deposition system
Publication number
20020029961
Publication date
Mar 14, 2002
APPLIED MATERIALS, INC.
Yezdi Dordi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
WAFER PROCESSING IN A CHAMBER WITH NOVEL GAS INLETS
Publication number
20020025657
Publication date
Feb 28, 2002
ROGER N. ANDERSON
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method and apparatus to overcome anomalies in copper seed layers an...
Publication number
20020011415
Publication date
Jan 31, 2002
APPLIED MATERIALS, INC.
Peter Hey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR