Peter Wiesner

Person

Reut, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Wire guide roll for wire saw and method
- Patent number 10,245,661
- Issue date Apr 2, 2019
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing wafers from a workpiece by means of a wire saw
- Patent number 9,662,804
- Issue date May 30, 2017
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for resuming a wire sawing process of a workpiece after an u...
- Patent number 9,427,888
- Issue date Aug 30, 2016
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing wafers from a workpiece
- Patent number 9,073,135
- Issue date Jul 7, 2015
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cooling a workpiece made of semiconductor material durin...
- Patent number 8,968,054
- Issue date Mar 3, 2015
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing wafers from a workpiece
- Patent number 8,746,227
- Issue date Jun 10, 2014
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sawing strip and method for simultaneously cutting off a multiplici...
- Patent number 7,971,584
- Issue date Jul 5, 2011
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for cutting slices from a workpiece
- Patent number 6,773,333
- Issue date Aug 10, 2004
- Siltronic AG
- Holger Lundt
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230286067
- Publication date Sep 14, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230234261
- Publication date Jul 27, 2023
- Siltronic AG
- Axel Beyer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230234149
- Publication date Jul 27, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230226629
- Publication date Jul 20, 2023
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...
- Publication number 20230050459
- Publication date Feb 16, 2023
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...
- Publication number 20220234250
- Publication date Jul 28, 2022
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW
- Publication number 20220040883
- Publication date Feb 10, 2022
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WAFERS FROM A WORKPIECE BY MEANS OF A WIRE SAW
- Publication number 20150158203
- Publication date Jun 11, 2015
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR RESUMING A WIRE SAWING PROCESS OF A WORKPIECE AFTER AN U...
- Publication number 20140144420
- Publication date May 29, 2014
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SLICING WAFERS FROM A WORKPIECE
- Publication number 20120240915
- Publication date Sep 27, 2012
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SLICING WAFERS FROM A WORKPIECE
- Publication number 20120240914
- Publication date Sep 27, 2012
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR COOLING A WORKPIECE MADE OF SEMICONDUCTOR MATERIAL DURIN...
- Publication number 20120178346
- Publication date Jul 12, 2012
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wire Guide Roll For Wire Saw
- Publication number 20080264228
- Publication date Oct 30, 2008
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sawing Strip And Method For Simultaneously Cutting Off A Multiplici...
- Publication number 20080011134
- Publication date Jan 17, 2008
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for cutting slices from a workpiece
- Publication number 20020174861
- Publication date Nov 28, 2002
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Holger Lundt
- B28 - WORKING CEMENT, CLAY, OR STONE

Peter Wiesner

Person

Patents Grantslast 30 patents

Wire guide roll for wire saw and method

Method for slicing wafers from a workpiece by means of a wire saw

Method for resuming a wire sawing process of a workpiece after an u...

Method for slicing wafers from a workpiece

Method for cooling a workpiece made of semiconductor material durin...

Method for slicing wafers from a workpiece

Sawing strip and method for simultaneously cutting off a multiplici...

Method for cutting slices from a workpiece

Patents Applicationslast 30 patents

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW

METHOD FOR SLICING WAFERS FROM A WORKPIECE BY MEANS OF A WIRE SAW

METHOD FOR RESUMING A WIRE SAWING PROCESS OF A WORKPIECE AFTER AN U...

METHOD FOR SLICING WAFERS FROM A WORKPIECE

METHOD FOR SLICING WAFERS FROM A WORKPIECE

METHOD FOR COOLING A WORKPIECE MADE OF SEMICONDUCTOR MATERIAL DURIN...

Wire Guide Roll For Wire Saw

Sawing Strip And Method For Simultaneously Cutting Off A Multiplici...

Method for cutting slices from a workpiece