Petra Fischer

Person

Wernberg, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor surface smoothing and semiconductor arrangement
- Patent number 11,373,857
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning a power metallization layer, electronic devic...
- Patent number 10,461,031
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recombination centers in a semiconductor device
- Patent number 10,347,491
- Issue date Jul 9, 2019
- Infineon Technologies Austria AG
- Wolfgang Jantscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate layer for copper structuring and methods of formation...
- Patent number 9,773,736
- Issue date Sep 26, 2017
- Infineon Technologies AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor wafer
- Patent number 9,059,273
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating semiconductor die using material modification
- Patent number 8,906,782
- Issue date Dec 9, 2014
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SURFACE SMOOTHING AND SEMICONDUCTOR ARRANGEMENT
- Publication number 20200365385
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Bernhard GOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Patterning a Power Metallization Layer, Electronic Devic...
- Publication number 20180358299
- Publication date Dec 13, 2018
- INFINEON TECHNOLOGIES AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recombination Centers in a Semiconductor Device
- Publication number 20180182629
- Publication date Jun 28, 2018
- Infineon Technologies Austria AG
- Wolfgang Jantscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Semiconductor Devices
- Publication number 20170110331
- Publication date Apr 20, 2017
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermediate Layer for Copper Structuring and Methods of Formation...
- Publication number 20160218033
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
- Publication number 20160126197
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20150064877
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING SEMICONDUCTOR DIE USING MATERIAL MODIFICATION
- Publication number 20150044856
- Publication date Feb 12, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING SEMICONDUCTOR DIE USING MATERIAL MODIFICATION
- Publication number 20130115755
- Publication date May 9, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF DIES AND A PROCESSING DEVICE F...
- Publication number 20130115757
- Publication date May 9, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS

Petra Fischer

Person

Patents Grantslast 30 patents

Semiconductor surface smoothing and semiconductor arrangement

Method for patterning a power metallization layer, electronic devic...

Forming recombination centers in a semiconductor device

Intermediate layer for copper structuring and methods of formation...

Methods for processing a semiconductor wafer

Method of separating semiconductor die using material modification

Patents Applicationslast 30 patents

SEMICONDUCTOR SURFACE SMOOTHING AND SEMICONDUCTOR ARRANGEMENT

Method for Patterning a Power Metallization Layer, Electronic Devic...

Forming Recombination Centers in a Semiconductor Device

Methods for Forming Semiconductor Devices

Intermediate Layer for Copper Structuring and Methods of Formation...

SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE

METHODS FOR PROCESSING A SEMICONDUCTOR WAFER

METHOD OF SEPARATING SEMICONDUCTOR DIE USING MATERIAL MODIFICATION

METHOD OF SEPARATING SEMICONDUCTOR DIE USING MATERIAL MODIFICATION

METHOD FOR SEPARATING A PLURALITY OF DIES AND A PROCESSING DEVICE F...