Petteri Palm

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including parallel electrically conductive la...
- Patent number 12,237,246
- Issue date Feb 25, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with non-uniformly distributed vias
- Patent number 12,159,829
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked transistor chip package with source coupling
- Patent number 12,094,807
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a multi-branch switch node connector
- Patent number 12,009,290
- Issue date Jun 11, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor system having an inductor module attached to a...
- Patent number 11,996,771
- Issue date May 28, 2024
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising side walls connected with c...
- Patent number 11,978,693
- Issue date May 7, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiphase inverter apparatus having half-bridge circuits and a pha...
- Patent number 11,979,096
- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power electronic assembly having a laminate inlay and method of pro...
- Patent number 11,903,132
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 11,791,255
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,776,882
- Issue date Oct 3, 2023
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,664,304
- Issue date May 30, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assembly and method of producing thereof
- Patent number 11,632,860
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a power semiconductor system
- Patent number 11,539,291
- Issue date Dec 27, 2022
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a solderable contact pad formed by a l...
- Patent number 11,532,541
- Issue date Dec 20, 2022
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 11,502,012
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space efficient and low parasitic half bridge
- Patent number 11,469,164
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,444,017
- Issue date Sep 13, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Forming a lock structure in a semiconductor chip pad
- Patent number 11,430,669
- Issue date Aug 30, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 11,373,944
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,348,861
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating a semiconductor pac...
- Patent number 11,302,610
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiphase inverter apparatus
- Patent number 11,303,222
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...
- Publication number 20240332099
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
- Publication number 20240021512
- Publication date Jan 18, 2024
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR
- Publication number 20230253304
- Publication date Aug 10, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLY HAVING A LAMINATE INLAY AND METHOD OF PRO...
- Publication number 20230240012
- Publication date Jul 27, 2023
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE
- Publication number 20230225055
- Publication date Jul 13, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION OF ELECTRONIC COMPONENT EMBEDDED...
- Publication number 20230164911
- Publication date May 25, 2023
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...
- Publication number 20230127874
- Publication date Apr 27, 2023
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Electrically Insulating Core with E...
- Publication number 20230077139
- Publication date Mar 9, 2023
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
- Publication number 20220399262
- Publication date Dec 15, 2022
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH CASTELLATED BOARD
- Publication number 20220377901
- Publication date Nov 24, 2022
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS
- Publication number 20220367350
- Publication date Nov 17, 2022
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20220238481
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PACKAGED CHIP, METHOD OF MANUFACTURING A PRE-PACKAGED CHIP, SEM...
- Publication number 20220230982
- Publication date Jul 21, 2022
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20220230941
- Publication date Jul 21, 2022
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPHASE INVERTER APPARATUS HAVING HALF-BRIDGE CIRCUITS AND A PHA...
- Publication number 20220224247
- Publication date Jul 14, 2022
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING
- Publication number 20220122906
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Sergey YUFEREV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220108945
- Publication date Apr 7, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...
- Publication number 20220102311
- Publication date Mar 31, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising Side Walls Connected with C...
- Publication number 20220037240
- Publication date Feb 3, 2022
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...
- Publication number 20210287964
- Publication date Sep 16, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20210233823
- Publication date Jul 29, 2021
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Solderable Contact Pad Formed by a L...
- Publication number 20210233837
- Publication date Jul 29, 2021
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space Efficient and Low Parasitic Half Bridge
- Publication number 20210225745
- Publication date Jul 22, 2021
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20210151401
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronic Assembly and Method of Producing Thereof
- Publication number 20210127490
- Publication date Apr 29, 2021
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiphase Inverter Apparatus
- Publication number 20210104957
- Publication date Apr 8, 2021
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Petteri Palm

Person

Patents Grantslast 30 patents

Semiconductor devices including parallel electrically conductive la...

Chip assembling on adhesion layer or dielectric layer, extending be...

Die package and method of forming a die package

Semiconductor package with non-uniformly distributed vias

Stacked transistor chip package with source coupling

Device including semiconductor chips and method for producing such...

Semiconductor module having a multi-branch switch node connector

Power semiconductor system having an inductor module attached to a...

Semiconductor device package comprising side walls connected with c...

Multiphase inverter apparatus having half-bridge circuits and a pha...

Power electronic assembly having a laminate inlay and method of pro...

Circuit board structure and method for manufacturing a circuit boar...

Die package and method of forming a die package

Method of fabricating a semiconductor package

Semiconductor module

Power electronic assembly and method of producing thereof

Device including semiconductor chips and method for producing such...

Method of manufacturing a power semiconductor system

Semiconductor package having a solderable contact pad formed by a l...

Semiconductor packages and methods of manufacturing thereof

Space efficient and low parasitic half bridge

Semiconductor package and method of manufacturing a semiconductor p...

Forming a lock structure in a semiconductor chip pad

Die package and method of forming a die package

Semiconductor package and method of manufacturing a semiconductor p...

Chip assembling on adhesion layer or dielectric layer, extending be...

Semiconductor package and method of fabricating a semiconductor pac...

Multiphase inverter apparatus

Circuit board structure and method for manufacturing a circuit boar...

Electronic module

Patents Applicationslast 30 patents

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...

DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE

SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR

POWER ELECTRONIC ASSEMBLY HAVING A LAMINATE INLAY AND METHOD OF PRO...

ELECTRONIC MODULE

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

ELECTROSTATIC DISCHARGE PROTECTION OF ELECTRONIC COMPONENT EMBEDDED...

POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...

Semiconductor Package Having an Electrically Insulating Core with E...

DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE

ELECTRONIC DEVICE WITH CASTELLATED BOARD

SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

PRE-PACKAGED CHIP, METHOD OF MANUFACTURING A PRE-PACKAGED CHIP, SEM...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

MULTIPHASE INVERTER APPARATUS HAVING HALF-BRIDGE CIRCUITS AND A PHA...

STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...

Semiconductor Device Package Comprising Side Walls Connected with C...

Circuit board structure and method for manufacturing a circuit boar...

ELECTRONIC MODULE

SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

Semiconductor Package Having a Solderable Contact Pad Formed by a L...

Space Efficient and Low Parasitic Half Bridge

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

Power Electronic Assembly and Method of Producing Thereof

Multiphase Inverter Apparatus