Peumie Abeyratne Kuragama

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...
- Publication number 20240222089
- Publication date Jul 4, 2024
- Intel Corporation
- Ala OMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS
- Publication number 20240222211
- Publication date Jul 4, 2024
- Intel Corporation
- Peumie Abeyratne Kuragama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE
- Publication number 20240006296
- Publication date Jan 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC FILM STRESS BUFFER FOR INTERFACE OF METAL AND DIELECTRIC
- Publication number 20230098501
- Publication date Mar 30, 2023
- Intel Corporation
- Sarah BLYTHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING HETEROGENEOUS DIELECTRIC LAYERS
- Publication number 20220139792
- Publication date May 5, 2022
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS