Pey Fang Hiew

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Kajang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with inner and outer leads
- Patent number 8,853,840
- Issue date Oct 7, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Yin Kheng Au
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...
- Publication number 20240395674
- Publication date Nov 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
- Publication number 20240014123
- Publication date Jan 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS
- Publication number 20150206829
- Publication date Jul 23, 2015
- Yin Kheng Au
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INNER AND OUTER LEADS
- Publication number 20140231978
- Publication date Aug 21, 2014
- Yin Kheng Au
- H01 - BASIC ELECTRIC ELEMENTS