Pheak Ti Teh

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Jitra, MY

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package substrates having a common die dependent...
- Patent number 9,780,040
- Issue date Oct 3, 2017
- Altera Corporation
- Siow Chek Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package with a universal lead frame
- Patent number 9,337,240
- Issue date May 10, 2016
- Altera Corporation
- Guan Khai Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit Systems And Methods Using Spacer Dies
- Publication number 20230100829
- Publication date Mar 30, 2023
- Intel Corporation
- Sheue Fen Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE POLYGON POWER AND GROUND INTERCONNECTS FOR INTEGRATED-CI...
- Publication number 20210183758
- Publication date Jun 17, 2021
- Intel Corporation
- Mohd Muhaiyiddin Bin Abdullah
- H01 - BASIC ELECTRIC ELEMENTS