Phil Neal

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Wakeman, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 9,263,416
- Issue date Feb 16, 2016
- Sumitomo Bakelite Co., Ltd.
- Christopher Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 8,816,485
- Issue date Aug 26, 2014
- Sumitomo Bakelite Co., Ltd.
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 8,120,168
- Issue date Feb 21, 2012
- Promerus LLC
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 7,932,161
- Issue date Apr 26, 2011
- Promerus LLC
- Chris Apanius
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Optical waveguides and methods for making the same
- Patent number 6,677,175
- Issue date Jan 13, 2004
- Promerus, LLC
- Xiao-Mei Zhao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymeric compositions for forming optical waveguides; optical wave...
- Patent number 6,538,087
- Issue date Mar 25, 2003
- Promerus, LLC
- Xiao-Mei Zhao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
- Publication number 20140349446
- Publication date Nov 27, 2014
- PROMERUS, LLC
- CHRISTOPHER APANIUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding
- Publication number 20120175721
- Publication date Jul 12, 2012
- Promerus LLC
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and materials useful for chip stacking, chip and wafer bonding
- Publication number 20080073741
- Publication date Mar 27, 2008
- Promerus LLC
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and materials useful for chip stacking, chip and wafer bonding
- Publication number 20070232026
- Publication date Oct 4, 2007
- Promerus LLC
- Chris Apanius
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polymeric compositions for forming optical waveguides; optical wave...
- Publication number 20020103317
- Publication date Aug 1, 2002
- Xiao-Mei Zhao
- G02 - OPTICS
Information Patent Application
Optical waveguides and methods for making the same
- Publication number 20020064896
- Publication date May 30, 2002
- Xiao-Mei Zhao
- G02 - OPTICS