Phil RUTTER

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Nijmegen, NL

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip packaged semiconductor device
- Patent number 12,159,818
- Issue date Dec 3, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated clamp diode
- Patent number 11,088,273
- Issue date Aug 10, 2021
- Nexperia B.V.
- Yan Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A CLAMPING DIODE
- Publication number 20230115609
- Publication date Apr 13, 2023
- NEXPERIA B.V.
- Yan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH MOSFET
- Publication number 20220376108
- Publication date Nov 24, 2022
- NEXPERIA B.V.
- Steven PEAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING MUTUALLY SEPARATED TRENCH STRUCTURES
- Publication number 20220285549
- Publication date Sep 8, 2022
- NEXPERIA B.V.
- Hungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH-GATE SEMICONDUCTOR DEVICE
- Publication number 20220231162
- Publication date Jul 21, 2022
- NEXPERIA B.V.
- Steven PEAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20220230942
- Publication date Jul 21, 2022
- NEXPERIA B.V.
- Ricardo YANDOC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20220223697
- Publication date Jul 14, 2022
- NEXPERIA B.V.
- Hungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Integrated Clamp Diode
- Publication number 20200227548
- Publication date Jul 16, 2020
- NEXPERIA B.V.
- Yan LAI
- H01 - BASIC ELECTRIC ELEMENTS