Philip E. Crabtree

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of making a die with recessed aluminum die pads
- Patent number 9,209,078
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a die with recessed aluminum die pads
- Patent number 8,722,530
- Issue date May 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for forming a semiconductor device and method thereof
- Patent number 7,256,113
- Issue date Aug 14, 2007
- Advanced Micro Devices, Inc.
- Kay Hellig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for monitoring wafer characteristics and/or se...
- Patent number 6,232,134
- Issue date May 15, 2001
- Motorola Inc.
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a thin oxide for use in semiconductor inte...
- Patent number 6,146,948
- Issue date Nov 14, 2000
- Motorola Inc.
- Wei Edwin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an inlaid via in a semiconductor device
- Patent number 6,054,377
- Issue date Apr 25, 2000
- Motorola, Inc.
- Stanley M. Filipiak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A DIE WITH RECESSED ALUMINUM DIE PADS
- Publication number 20140213050
- Publication date Jul 31, 2014
- FREESCALE SEMICONDUCTOR, INC.
- GREGORY S. SPENCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A DIE WITH RECESSED ALUMIUM DIE PADS
- Publication number 20130029485
- Publication date Jan 31, 2013
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS