Philip Lyndon Cablao

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with lead-frame paddle scheme for...
- Patent number 8,569,872
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat spreader stacking system
- Patent number 8,421,221
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with heatspreader
- Patent number 8,395,254
- Issue date Mar 12, 2013
- Stats Chippac Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interconnect and method of...
- Patent number 8,344,495
- Issue date Jan 1, 2013
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interconnect and method of...
- Patent number 8,304,921
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system having interconnect stack and ext...
- Patent number 8,138,080
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits package system with passive components
- Patent number 8,026,129
- Issue date Sep 27, 2011
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 7,911,046
- Issue date Mar 22, 2011
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat spreader stacking method
- Patent number 7,759,169
- Issue date Jul 20, 2010
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 7,518,226
- Issue date Apr 14, 2009
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-in-package system
- Patent number 7,439,620
- Issue date Oct 21, 2008
- Stats Chippac Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...
- Publication number 20110140261
- Publication date Jun 16, 2011
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...
- Publication number 20110115065
- Publication date May 19, 2011
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
- Publication number 20100224991
- Publication date Sep 9, 2010
- Dario S. Filoteo, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD-FRAME PADDLE SCHEME FOR...
- Publication number 20100001384
- Publication date Jan 7, 2010
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20090152704
- Publication date Jun 18, 2009
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20080185719
- Publication date Aug 7, 2008
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20080029905
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
- Publication number 20080012122
- Publication date Jan 17, 2008
- STATS ChipPAC Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER
- Publication number 20070235859
- Publication date Oct 11, 2007
- STATS ChipPAC Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS
- Publication number 20070210432
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070210436
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS

Philip Lyndon Cablao

Person

Patents Grantslast 30 patents

Integrated circuit package system with lead-frame paddle scheme for...

Integrated circuit heat spreader stacking system

Integrated circuit package system with heatspreader

Integrated circuit packaging system with interconnect and method of...

Integrated circuit packaging system with interconnect and method of...

Integrated circuit package system having interconnect stack and ext...

Stacked integrated circuits package system with passive components

Integrated circuit packaging system with interposer

Integrated circuit heat spreader stacking method

Integrated circuit packaging system with interposer

Integrated circuit package-in-package system

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...

INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD-FRAME PADDLE SCHEME FOR...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM

INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER

STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS

INTEGRATED CIRCUIT PACKAGE SYSTEM