Philip Winterbottom

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electro-photonic network for machine learning
- Patent number 12,353,006
- Issue date Jul 8, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock signal distribution using photonic fabric
- Patent number 12,339,490
- Issue date Jun 24, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electro-photonic network for machine learning
- Patent number 12,339,492
- Issue date Jun 24, 2025
- Celestial AI Inc.
- Martinus Bos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optically bridged multicomponent package with extended temperature...
- Patent number 12,298,608
- Issue date May 13, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G01 - MEASURING TESTING
Information Patent Grant
Photonic memory fabric for system memory interconnection
- Patent number 12,271,595
- Issue date Apr 8, 2025
- Celestial AI Inc.
- David Lazovsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock signal distribution using photonic fabric
- Patent number 12,259,575
- Issue date Mar 25, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multicomponent photonically intra-die bridged assembly
- Patent number 12,242,122
- Issue date Mar 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Load/store unit for a tensor engine and methods for loading or stor...
- Patent number 12,217,056
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical bridging element for separately stacked electrical ICs
- Patent number 12,216,318
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge (OMIB)
- Patent number 11,835,777
- Issue date Dec 5, 2023
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Balanced photonic architectures for matrix computations
- Patent number 11,509,397
- Issue date Nov 22, 2022
- Celestial AI Inc.
- Yangjin Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Upstream channels for distributed CMTS
- Patent number 11,418,450
- Issue date Aug 16, 2022
- Vecima Networks Inc.
- Keil Brewer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Provisioning network services for cable systems
- Patent number 10,797,942
- Issue date Oct 6, 2020
- Nokia of America Corporation
- Alok Khambatkone
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dynamic service flow creation for packet cable quality of service g...
- Patent number 10,516,905
- Issue date Dec 24, 2019
- Nokia of America Corporation
- Rajesh Karnik
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dynamic service flow creation for packet cable multimedia quality o...
- Patent number 10,390,058
- Issue date Aug 20, 2019
- Nokia of America Corporation
- Rajesh Karnik
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Selective configuration of packet engine for cable service flows
- Patent number 10,142,171
- Issue date Nov 27, 2018
- NOKIA OF AMERICA CORPORATION
- Iswar Biswal
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mapping cable service flows to IP network
- Patent number 10,122,625
- Issue date Nov 6, 2018
- NOKIA OF AMERICA CORPORATION
- Iswar Biswal
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Assigning QoS to cable service flows
- Patent number 10,091,071
- Issue date Oct 2, 2018
- Nokia of America Corporation
- Iswar Biswal
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and method for deploying new equipment and services in conju...
- Patent number 6,987,838
- Issue date Jan 17, 2006
- Entrisphere, Inc.
- Philip Winterbottom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231431
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231430
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231432
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231429
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...
- Publication number 20250216632
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Application
EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...
- Publication number 20250216598
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALING CHIPS WITH OPTICAL MEMORY APPLIANCES
- Publication number 20250190357
- Publication date Jun 12, 2025
- Celestial AI Inc.
- Francisco José Maia Da Silva
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS
- Publication number 20250123452
- Publication date Apr 17, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED MEMORY ARCHITECTURE
- Publication number 20250076572
- Publication date Mar 6, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Application
Load/Store Unit for a Tensor Engine and Methods for Loading or Stor...
- Publication number 20240403046
- Publication date Dec 5, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC
- Publication number 20240345316
- Publication date Oct 17, 2024
- Celestial AI Inc.
- Martinus Bos
- G02 - OPTICS
Information Patent Application
ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING
- Publication number 20240280747
- Publication date Aug 22, 2024
- Celestial AI, Inc.
- Martinus Bos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY
- Publication number 20240272393
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY
- Publication number 20240272392
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS
- Publication number 20240219664
- Publication date Jul 4, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING
- Publication number 20240201436
- Publication date Jun 20, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC
- Publication number 20240201437
- Publication date Jun 20, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PULSE-DENSITY MODULATION FOR TUNING A THERMALLY CONTROLLED, RESONAN...
- Publication number 20240176169
- Publication date May 30, 2024
- Subal Sahni
- G02 - OPTICS
Information Patent Application
HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP
- Publication number 20240111091
- Publication date Apr 4, 2024
- Celestial AI, Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...
- Publication number 20240027711
- Publication date Jan 25, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE
- Publication number 20230418010
- Publication date Dec 28, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC
- Publication number 20230296838
- Publication date Sep 21, 2023
- Celestial AI Inc.
- David LAZOVSKY
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)
- Publication number 20230296854
- Publication date Sep 21, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
PHOTONIC MEMORY FABRIC FOR SYSTEM MEMORY INTERCONNECTION
- Publication number 20230297237
- Publication date Sep 21, 2023
- Celestial AI Inc.
- David LAZOVSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CHIP ELECTRO-PHOTONIC NETWORK
- Publication number 20220405566
- Publication date Dec 22, 2022
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC
- Publication number 20220404545
- Publication date Dec 22, 2022
- Celestial Al Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Application
DIGITAL NEURAL NETWORK
- Publication number 20220405056
- Publication date Dec 22, 2022
- Celestial Al Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING
- Publication number 20220405562
- Publication date Dec 22, 2022
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP
- Publication number 20220404544
- Publication date Dec 22, 2022
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Application
BALANCED PHOTONIC ARCHITECTURES FOR MATRIX COMPUTATIONS
- Publication number 20220263582
- Publication date Aug 18, 2022
- Celestial AI Inc.
- Yangjin Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Philip Winterbottom

Person

Patents Grantslast 30 patents

Electro-photonic network for machine learning

Clock signal distribution using photonic fabric

Electro-photonic network for machine learning

Optically bridged multicomponent package with extended temperature...

Photonic memory fabric for system memory interconnection

Clock signal distribution using photonic fabric

Multicomponent photonically intra-die bridged assembly

Load/store unit for a tensor engine and methods for loading or stor...

Optical bridging element for separately stacked electrical ICs

Manufacturing optically accessible co-packaged optics

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

Stacked-dies optically bridged multicomponent package

Optical multi-die interconnect bridge with optical interface

Optical multi-die interconnect bridge (OMIB)

Balanced photonic architectures for matrix computations

Upstream channels for distributed CMTS

Provisioning network services for cable systems

Dynamic service flow creation for packet cable quality of service g...

Dynamic service flow creation for packet cable multimedia quality o...

Selective configuration of packet engine for cable service flows

Mapping cable service flows to IP network

Assigning QoS to cable service flows

System and method for deploying new equipment and services in conju...

Patents Applicationslast 30 patents

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...

EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...

SCALING CHIPS WITH OPTICAL MEMORY APPLIANCES

MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS

DISAGGREGATED MEMORY ARCHITECTURE

Load/Store Unit for a Tensor Engine and Methods for Loading or Stor...

CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC

ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING

MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY

MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY

OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS

ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING

CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC

PULSE-DENSITY MODULATION FOR TUNING A THERMALLY CONTROLLED, RESONAN...

HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE

CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC

OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)

PHOTONIC MEMORY FABRIC FOR SYSTEM MEMORY INTERCONNECTION

MULTI-CHIP ELECTRO-PHOTONIC NETWORK

CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC

DIGITAL NEURAL NETWORK

ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING

HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP

BALANCED PHOTONIC ARCHITECTURES FOR MATRIX COMPUTATIONS