Philip Yashar

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper interconnect cladding
- Patent number 11,270,943
- Issue date Mar 8, 2022
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance interconnect
- Patent number 10,446,439
- Issue date Oct 15, 2019
- Intel Corporation
- Philip Yashar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layers
- Patent number 8,508,018
- Issue date Aug 13, 2013
- Intel Corporation
- Rohan N. Akolkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MAT...
- Publication number 20240112951
- Publication date Apr 4, 2024
- Intel Corporation
- Philip Yashar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT CLADDING
- Publication number 20220157735
- Publication date May 19, 2022
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED I...
- Publication number 20220068802
- Publication date Mar 3, 2022
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT CLADDING
- Publication number 20190304918
- Publication date Oct 3, 2019
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFRACTORY METAL ALLOY TARGETS FOR PHYSICAL VAPOR DEPOSITION
- Publication number 20180327887
- Publication date Nov 15, 2018
- Intel Corporation
- Christopher J. WIEGAND
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LOW RESISTANCE INTERCONNECT
- Publication number 20180301373
- Publication date Oct 18, 2018
- Intel Corporation
- Philip Yashar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS
- Publication number 20120077053
- Publication date Mar 29, 2012
- Rohan N. Akolkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
One-mask process flow for simultaneously constructing a capacitor a...
- Publication number 20040063295
- Publication date Apr 1, 2004
- Intel Corporation
- Stephen T. Chambers
- H01 - BASIC ELECTRIC ELEMENTS

Philip Yashar

Person

Patents Grantslast 30 patents

Copper interconnect cladding

Low resistance interconnect

Barrier layers

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MAT...

COPPER INTERCONNECT CLADDING

METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED I...

COPPER INTERCONNECT CLADDING

REFRACTORY METAL ALLOY TARGETS FOR PHYSICAL VAPOR DEPOSITION

LOW RESISTANCE INTERCONNECT

BARRIER LAYERS

One-mask process flow for simultaneously constructing a capacitor a...