TREA

Philip Yu-Shuan Chung

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  • Taipei City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Reflow method and system
    • Patent number 12,176,319
    • Issue date Dec 24, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Cheng-Shiuan Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding through multi-shot laser reflow
    • Patent number 12,040,309
    • Issue date Jul 16, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method of package on package structure
    • Patent number 11,996,400
    • Issue date May 28, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Hsuan-Ting Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package and method
    • Patent number 11,942,464
    • Issue date Mar 26, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Hao-Jan Pei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and method of manufacture
    • Patent number 11,830,746
    • Issue date Nov 28, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Wei-Yu Chen
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor structure and method
    • Patent number 11,646,293
    • Issue date May 9, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Chia-Shen Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Reflow method and system
    • Patent number 11,610,859
    • Issue date Mar 21, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Cheng-Shiuan Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding through multi-shot laser reflow
    • Patent number 11,462,507
    • Issue date Oct 4, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method of package on package structure
    • Patent number 11,342,321
    • Issue date May 24, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Hsuan-Ting Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package and method
    • Patent number 11,069,671
    • Issue date Jul 20, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Hao-Jan Pei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding through multi-shot laser reflow
    • Patent number 10,790,261
    • Issue date Sep 29, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method of package on package structure
    • Patent number 10,535,644
    • Issue date Jan 14, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Hsuan-Ting Kuo
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    REFLOW METHOD AND SYSTEM
    • Publication number 20250070077
    • Publication date Feb 27, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Shiuan Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
    • Publication number 20240274589
    • Publication date Aug 15, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsuan-Ting Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING THROUGH MULTI-SHOT LASER REFLOW
    • Publication number 20240234365
    • Publication date Jul 11, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF FORMING SEMICONDUCTOR PACKAGES
    • Publication number 20240203971
    • Publication date Jun 20, 2024
    • Taiwan Semiconductor Manufacturning Company, Ltd.
    • Hao-Jan Pei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
    • Publication number 20230386862
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wei-Yu Chen
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    REFLOW METHOD AND SYSTEM
    • Publication number 20230197671
    • Publication date Jun 22, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Shiuan Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding Through Multi-Shot Laser Reflow
    • Publication number 20220367408
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
    • Publication number 20220254767
    • Publication date Aug 11, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsuan-Ting Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
    • Publication number 20220216071
    • Publication date Jul 7, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REFLOW METHOD AND SYSTEM
    • Publication number 20220130795
    • Publication date Apr 28, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Shiuan Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor Structure and Method
    • Publication number 20220028823
    • Publication date Jan 27, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chia-Shen Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Method
    • Publication number 20210351172
    • Publication date Nov 11, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Jan Pei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding Through Multi-Shot Laser Reflow
    • Publication number 20210013173
    • Publication date Jan 14, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
    • Publication number 20200152616
    • Publication date May 14, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Hsuan-Ting Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
    • Publication number 20200006308
    • Publication date Jan 2, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Hsuan-Ting Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Method
    • Publication number 20190296002
    • Publication date Sep 26, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Jan Pei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding Through Multi-Shot Laser Reflow
    • Publication number 20190279958
    • Publication date Sep 12, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Wei-Yu Chen
    • H01 - BASIC ELECTRIC ELEMENTS