Philipp ENGESSER

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Patents Grantslast 30 patents

Information Patent Grant
Method and device for plating a recess in a substrate
- Patent number 11,164,748
- Issue date Nov 2, 2021
- Semsyso GMBH
- Franz Markut
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wet-dry integrated wafer processing system
- Patent number 10,249,521
- Issue date Apr 2, 2019
- Lam Research AG
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for measuring the distribution or impulse of a series of dro...
- Patent number 9,960,057
- Issue date May 1, 2018
- Lam Research AG
- Michael Dalmer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISTRIBUTION BODY FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLY...
- Publication number 20230026551
- Publication date Jan 26, 2023
- Semsysco GmbH
- Andreas GLEISSNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE
- Publication number 20220020591
- Publication date Jan 20, 2022
- Semsysco GmbH
- Franz Markut
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE
- Publication number 20190228975
- Publication date Jul 25, 2019
- Semsysco GmbH
- Franz Markut
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET-DRY INTEGRATED WAFER PROCESSING SYSTEM
- Publication number 20170271180
- Publication date Sep 21, 2017
- LAM RESEARCH AG
- Thorsten LILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR MEASURING THE DISTRIBUTION OR IMPULSE OF A SERIES OF DRO...
- Publication number 20160181129
- Publication date Jun 23, 2016
- LAM RESEARCH AG
- Michael DALMER
- G01 - MEASURING TESTING