Philipp K. BUCHLING REGO

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cryptographic hardware security module with secure embedded heat pipe
- Patent number 11,991,277
- Issue date May 21, 2024
- International Business Machines Corporation
- Arthur J. Higby
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi chip hardware security module
- Patent number 11,882,645
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assemblies with pressure connector assemblies
- Patent number 11,765,816
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Arthur J. Higby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assemblies with porous heat transfer element(s)
- Patent number 11,716,808
- Issue date Aug 1, 2023
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Dielectric material change to optimize electrical and mechanical pr...
- Patent number 11,382,210
- Issue date Jul 5, 2022
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DATA-ANALYSIS-BASED FEEDBACK OF COMPONENT POSITIONING WITHIN AN ELE...
- Publication number 20240431086
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES
- Publication number 20240121890
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Arthur J. Higby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES
- Publication number 20230418009
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Yuanchen Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI CHIP HARDWARE SECURITY MODULE
- Publication number 20230130104
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYPTOGRAPHIC HARDWARE SECURITY MODULE WITH SECURE EMBEDDED HEAT PIPE
- Publication number 20230054606
- Publication date Feb 23, 2023
- International Business Machines Corporation
- Arthur J. Higby
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH PRESSURE CONNECTOR ASSEMBLIES
- Publication number 20230052840
- Publication date Feb 16, 2023
- International Business Machines Corporation
- Arthur J. HIGBY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC MATERIAL CHANGE TO OPTIMIZE ELECTRICAL AND MECHANICAL PR...
- Publication number 20220201839
- Publication date Jun 23, 2022
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)
- Publication number 20220192011
- Publication date Jun 16, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL

Philipp K. BUCHLING REGO

Person

Patents Grantslast 30 patents

Cryptographic hardware security module with secure embedded heat pipe

Multi chip hardware security module

Tamper-respondent assemblies with pressure connector assemblies

Tamper-respondent assemblies with porous heat transfer element(s)

Dielectric material change to optimize electrical and mechanical pr...

Patents Applicationslast 30 patents

DATA-ANALYSIS-BASED FEEDBACK OF COMPONENT POSITIONING WITHIN AN ELE...

TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES

THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES

MULTI CHIP HARDWARE SECURITY MODULE

CRYPTOGRAPHIC HARDWARE SECURITY MODULE WITH SECURE EMBEDDED HEAT PIPE

TAMPER-RESPONDENT ASSEMBLIES WITH PRESSURE CONNECTOR ASSEMBLIES

DIELECTRIC MATERIAL CHANGE TO OPTIMIZE ELECTRICAL AND MECHANICAL PR...

TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)