Philipp Seng

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with integrated temperature protection
- Patent number 11,276,680
- Issue date Mar 15, 2022
- Infineon Technologies Austria AG
- Daniel Pedone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor diode
- Patent number 10,854,598
- Issue date Dec 1, 2020
- Infineon Technologies Austria AG
- Anton Mauder
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor devices and methods for forming semiconductor devices
- Patent number 10,516,065
- Issue date Dec 24, 2019
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor diode and method for forming a semiconductor diode
- Patent number 10,164,043
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device and a semiconductor device
- Patent number 9,911,808
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated gate bipolar transistor comprising negative temperature c...
- Patent number 9,825,023
- Issue date Nov 21, 2017
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly including a chip carrier, semiconduct...
- Patent number 9,768,120
- Issue date Sep 19, 2017
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral PIN diode and method for processing same
- Patent number 6,972,469
- Issue date Dec 6, 2005
- Infineon Technologies AG
- Raimund Peichl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
- Publication number 20250125218
- Publication date Apr 17, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method of Producing a Power Semicond...
- Publication number 20250107115
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Manfred Pfaffenlehner
Information Patent Application
Electronic Module Comprising a Semiconductor Package with Integrate...
- Publication number 20200294885
- Publication date Sep 17, 2020
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Forming Semiconductor Devices
- Publication number 20180013013
- Publication date Jan 11, 2018
- INFINEON TECHNOLOGIES AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device and a Semiconductor Device
- Publication number 20170229539
- Publication date Aug 10, 2017
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Temperature Protection
- Publication number 20160133620
- Publication date May 12, 2016
- Infineon Technologies Austria AG
- Daniel Pedone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Gate Bipolar Transistor Comprising Negative Temperature C...
- Publication number 20160111415
- Publication date Apr 21, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIODE
- Publication number 20150162325
- Publication date Jun 11, 2015
- Infineon Technologies Austria AG
- Anton Mauder
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...
- Publication number 20140138833
- Publication date May 22, 2014
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Diode and Method for Forming a Semiconductor Diode
- Publication number 20130175529
- Publication date Jul 11, 2013
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIODE
- Publication number 20100117725
- Publication date May 13, 2010
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral PIN diode and method for processing same
- Publication number 20040119130
- Publication date Jun 24, 2004
- Raimund Peichl
- H01 - BASIC ELECTRIC ELEMENTS

Philipp Seng

Person

Patents Grantslast 30 patents

Electronic module comprising a semiconductor package with integrate...

Power semiconductor device with integrated temperature protection

Semiconductor diode

Semiconductor devices and methods for forming semiconductor devices

Semiconductor diode and method for forming a semiconductor diode

Method for forming a semiconductor device and a semiconductor device

Insulated gate bipolar transistor comprising negative temperature c...

Semiconductor device assembly including a chip carrier, semiconduct...

Lateral PIN diode and method for processing same

Patents Applicationslast 30 patents

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

Power Semiconductor Device and Method of Producing a Power Semicond...

Electronic Module Comprising a Semiconductor Package with Integrate...

Semiconductor Devices and Methods for Forming Semiconductor Devices

Method for Forming a Semiconductor Device and a Semiconductor Device

Power Semiconductor Device with Temperature Protection

Insulated Gate Bipolar Transistor Comprising Negative Temperature C...

SEMICONDUCTOR DIODE

Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...

Semiconductor Diode and Method for Forming a Semiconductor Diode

SEMICONDUCTOR DIODE

Lateral PIN diode and method for processing same