Philippe Mark Vereecken

Person

Sleepy Hollow, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of aligned capped metal lines and interconnections in mul...
- Patent number 7,825,516
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free damascene copper deposition process and means of monitori...
- Patent number 7,678,258
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate stack engineering by electrochemical processing utilizing thro...
- Patent number 7,368,045
- Issue date May 6, 2008
- International Business Machines Corporation
- Philippe M. Vereecken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping of copper wiring
- Patent number 7,008,871
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electroplating on resistive substrates
- Patent number 6,974,531
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Field effect transistor with electroplated metal gate
- Patent number 6,967,131
- Issue date Nov 22, 2005
- International Business Machines Corp.
- Katherine L. Saenger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Gate stack engineering by electrochemical processing utilizing thro...
- Publication number 20060166474
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Philippe M. Vereecken
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20050199502
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Field effect transistor with electroplated metal gate
- Publication number 20050095852
- Publication date May 5, 2005
- International Business Machines
- Katherine L. Saenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-free damascene copper deposition process and means of monitori...
- Publication number 20050006242
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Selective capping of copper wiring
- Publication number 20050001325
- Publication date Jan 6, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of aligned capped metal lines and interconnections in mul...
- Publication number 20040113277
- Publication date Jun 17, 2004
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming planar Cu interconnects without chemical mechanic...
- Publication number 20040094511
- Publication date May 20, 2004
- International Business Machines Corporation
- Soon-Cheon Seo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20040069648
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Philippe Mark Vereecken

Person

Patents Grantslast 30 patents

Formation of aligned capped metal lines and interconnections in mul...

Void-free damascene copper deposition process and means of monitori...

Gate stack engineering by electrochemical processing utilizing thro...

Selective capping of copper wiring

Method for electroplating on resistive substrates

Field effect transistor with electroplated metal gate

Patents Applicationslast 30 patents

Gate stack engineering by electrochemical processing utilizing thro...

Method for electroplating on resistive substrates

Field effect transistor with electroplated metal gate

Void-free damascene copper deposition process and means of monitori...

Selective capping of copper wiring

Formation of aligned capped metal lines and interconnections in mul...

Method of forming planar Cu interconnects without chemical mechanic...

Method for electroplating on resistive substrates