Phillip Adamson

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Surrey, GB

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Patents Grantslast 30 patents

Information Patent Grant
Contact pad structure for flip chip semiconductor die
- Patent number 7,821,133
- Issue date Oct 26, 2010
- International Rectifier Corporation
- Hazel D. Schofield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with substrates for redistributing se...
- Patent number 7,745,930
- Issue date Jun 29, 2010
- International Rectifier Corporation
- Norman Glyn Connah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Contact pad structure for flip chip semiconductor die
- Publication number 20070096316
- Publication date May 3, 2007
- International Rectifier Corporation
- Hazel D. Schofield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device packages with substrates for redistributing se...
- Publication number 20060261473
- Publication date Nov 23, 2006
- International Rectifier Corporation
- Norman Glyn Connah
- H03 - BASIC ELECTRONIC CIRCUITRY