Phillip R. Coffman

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Rowlett, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,445,960
- Issue date Nov 4, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,319,275
- Issue date Jan 15, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,276,401
- Issue date Oct 2, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,271,494
- Issue date Sep 18, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 6,869,831
- Issue date Mar 22, 2005
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid porous low-K dielectrics for integrated circuits
- Patent number 6,514,881
- Issue date Feb 4, 2003
- Texas Instruments Incorporated
- Phillip R. Coffman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20080050860
- Publication date Feb 28, 2008
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20070128881
- Publication date Jun 7, 2007
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20050212149
- Publication date Sep 29, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20050161834
- Publication date Jul 28, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waferlevel method for direct bumping on copper pads in integrated c...
- Publication number 20040157450
- Publication date Aug 12, 2004
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving contact resistance
- Publication number 20040115934
- Publication date Jun 17, 2004
- Jerry Broz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waferlevel method for direct bumping on copper pads in integrated c...
- Publication number 20030116845
- Publication date Jun 26, 2003
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS