Phillip W. Palmatier

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
System for treating solution for use in electroplating application...
- Patent number 11,053,604
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Prevent and remove organics from reservoir wells
- Patent number 10,895,017
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Prevent and remove organics from reservoir wells
- Patent number 10,718,062
- Issue date Jul 21, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System for treating solution for use in electroplating application...
- Patent number 10,450,667
- Issue date Oct 22, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Prevent and remove organics from reservoir wells
- Patent number 10,392,720
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Prevent and remove organics from reservoir wells
- Patent number 10,087,546
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system and method of using electroplating system for...
- Patent number 10,053,794
- Issue date Aug 21, 2018
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system and method of using electroplating system for...
- Patent number 9,777,388
- Issue date Oct 3, 2017
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Vacuum transition for solder bump mold filling
- Patent number 9,498,837
- Issue date Nov 22, 2016
- International Business Machines Corporation
- John J. Garant
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatuses, systems and methods that allow for selective removal o...
- Patent number 9,428,841
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fill head interface with combination vacuum pressure chamber
- Patent number 9,278,401
- Issue date Mar 8, 2016
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making interconnect solder Pb-free bumps free from orga...
- Patent number 7,833,897
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Sarah H. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electroplating a film onto a substrate
- Patent number 6,241,868
- Issue date Jun 5, 2001
- International Business Machines Corporation
- Glen N. Biggs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus with self-cleaning contacts
- Patent number 6,080,289
- Issue date Jun 27, 2000
- International Business Machines Corporation
- Phillip W. Palmatier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for making electrical contact to a substrate d...
- Patent number 6,077,405
- Issue date Jun 20, 2000
- International Business Machines Corporation
- Glen N. Biggs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for plating pin grid array packaging modules
- Patent number 5,869,139
- Issue date Feb 9, 1999
- International Business Machines Corporation
- Glen N. Biggs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR TREATING SOLUTION FOR USE IN ELECTROPLATING APPLICATION...
- Publication number 20190345627
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS
- Publication number 20190338441
- Publication date Nov 7, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS
- Publication number 20180355507
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS
- Publication number 20180355506
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM AND METHOD OF USING ELECTROPLATING SYSTEM FOR...
- Publication number 20180016699
- Publication date Jan 18, 2018
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM AND METHOD OF USING ELECTROPLATING SYSTEM FOR...
- Publication number 20160115616
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS
- Publication number 20160115617
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM FOR TREATING SOLUTION FOR USE IN ELECTROPLATING APPLICATION...
- Publication number 20160115618
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUSES, SYSTEMS AND METHODS THAT ALLOW FOR SELECTIVE REMOVAL O...
- Publication number 20150337452
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER
- Publication number 20140224860
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING
- Publication number 20110049759
- Publication date Mar 3, 2011
- International Business Machines Corporation
- John J. Garant
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD
- Publication number 20090242614
- Publication date Oct 1, 2009
- International Business Machines Corporation
- GLEN N. BIGGS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGA...
- Publication number 20090020590
- Publication date Jan 22, 2009
- International Business Machines Corporation
- Sarah H. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Phillip W. Palmatier

Person

Patents Grantslast 30 patents

System for treating solution for use in electroplating application...

Prevent and remove organics from reservoir wells

Prevent and remove organics from reservoir wells

System for treating solution for use in electroplating application...

Prevent and remove organics from reservoir wells

Prevent and remove organics from reservoir wells

Electroplating system and method of using electroplating system for...

Electroplating system and method of using electroplating system for...

Vacuum transition for solder bump mold filling

Apparatuses, systems and methods that allow for selective removal o...

Fill head interface with combination vacuum pressure chamber

Process for making interconnect solder Pb-free bumps free from orga...

Method for electroplating a film onto a substrate

Electroplating apparatus with self-cleaning contacts

Method and apparatus for making electrical contact to a substrate d...

Apparatus and method for plating pin grid array packaging modules

Patents Applicationslast 30 patents

SYSTEM FOR TREATING SOLUTION FOR USE IN ELECTROPLATING APPLICATION...

PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS

PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS

PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS

ELECTROPLATING SYSTEM AND METHOD OF USING ELECTROPLATING SYSTEM FOR...

ELECTROPLATING SYSTEM AND METHOD OF USING ELECTROPLATING SYSTEM FOR...

PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS

SYSTEM FOR TREATING SOLUTION FOR USE IN ELECTROPLATING APPLICATION...

APPARATUSES, SYSTEMS AND METHODS THAT ALLOW FOR SELECTIVE REMOVAL O...

FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER

VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING

METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD

PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGA...