Phillip Young

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Simi Valley, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Process to remove semiconductor chips from a plastic package
- Patent number 6,429,028
- Issue date Aug 6, 2002
- DPA Labs, Incorporated
- Philip Young
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process to remove semiconductor chips from a plastic package
- Publication number 20020048825
- Publication date Apr 25, 2002
- Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS