Phillipe Vereecken

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Yorktown Heights, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and plating method
- Patent number 7,553,400
- Issue date Jun 30, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for substrate
- Patent number 7,311,809
- Issue date Dec 25, 2007
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Plating apparatus for substrate
- Publication number 20050077173
- Publication date Apr 14, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR