Phuong T. Le

Person

Goodyear, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cascode semiconductor package and related methods
- Patent number 10,651,115
- Issue date May 12, 2020
- Semiconductor Components Industries, LLC
- Phuong Trong Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode semiconductor package and related methods
- Patent number 10,269,690
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Phuong Trong Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode semiconductor package and related methods
- Patent number 9,881,854
- Issue date Jan 30, 2018
- Semiconductor Components Industries, LLC
- Phuong Trong Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method
- Patent number 9,799,627
- Issue date Oct 24, 2017
- Semiconductor Components Industries, LLC
- Bishnu Prasanna Gogoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode semiconductor package and related methods
- Patent number 9,496,207
- Issue date Nov 15, 2016
- Semiconductor Components Industries, LLC
- Phuong Trong Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flange package for a semiconductor device
- Patent number 8,618,650
- Issue date Dec 31, 2013
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flange package for a semiconductor device
- Patent number 8,338,937
- Issue date Dec 25, 2012
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CASCODE SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190252303
- Publication date Aug 15, 2019
- Semiconductor Components Industries, LLC
- Phuong Trong LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASCODE SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20180130726
- Publication date May 10, 2018
- Semiconductor Components Industries, LLC
- Phuong Trong LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASCODE SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20170077015
- Publication date Mar 16, 2017
- Semiconductor Components Industries, LLC
- Phuong Trong LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD
- Publication number 20140035114
- Publication date Feb 6, 2014
- Semiconductor Components Industries, LLC
- Bishnu Prasanna Gogoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLANGE PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20130087894
- Publication date Apr 11, 2013
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flange Package For A Semiconductor Device
- Publication number 20100032825
- Publication date Feb 11, 2010
- HVVI SEMICONDUCTORS, INC.
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-chip harmonic termination for RF power amplifier applications
- Publication number 20070057731
- Publication date Mar 15, 2007
- Phuong T. Le
- H03 - BASIC ELECTRONIC CIRCUITRY

Phuong T. Le

Person

Patents Grantslast 30 patents

Cascode semiconductor package and related methods

Cascode semiconductor package and related methods

Cascode semiconductor package and related methods

Semiconductor package structure and method

Cascode semiconductor package and related methods

Flange package for a semiconductor device

Flange package for a semiconductor device

Patents Applicationslast 30 patents

CASCODE SEMICONDUCTOR PACKAGE AND RELATED METHODS

CASCODE SEMICONDUCTOR PACKAGE AND RELATED METHODS

CASCODE SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD

FLANGE PACKAGE FOR A SEMICONDUCTOR DEVICE

Flange Package For A Semiconductor Device

On-chip harmonic termination for RF power amplifier applications