PI LING HUANG

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TAIPEI, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die mounted in a recess of die pad
- Patent number 11,862,538
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Chung-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with three dimensional thermal pad
- Patent number 11,081,428
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal fiber, raman spectrometer using the same and detection meth...
- Patent number 8,934,093
- Issue date Jan 13, 2015
- NATIONAL TAIWAN UNIVERSITY
- Pi Ling Huang
- G01 - MEASURING TESTING
Information Patent Grant
Two-mirror figure “8” ring resonantor
- Patent number 6,570,904
- Issue date May 27, 2003
- National Science Council
- Huy-Zu Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE PAD RECESSES
- Publication number 20230063262
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Chung-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
- Publication number 20210043548
- Publication date Feb 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL FIBER, RAMAN SPECTROMETER USING THE SAME AND DETECTION METH...
- Publication number 20120212736
- Publication date Aug 23, 2012
- National Taiwan University
- PI LING HUANG
- G01 - MEASURING TESTING