Pi-Yu Peng

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Tray
- Patent number 11,764,090
- Issue date Sep 19, 2023
- Chipbond Technology Corporation
- Hsu-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20230380053
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAY
- Publication number 20220328334
- Publication date Oct 13, 2022
- Chipbond Technology Corporation
- Hsu-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS