Pierre Langevin

Person

Granby, CA

People

Patents Grantslast 30 patents

Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,408,264
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,119,003
- Issue date Oct 10, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,109,592
- Issue date Sep 19, 2006
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,067,916
- Issue date Jun 27, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of flux by ink stop line in chip joining
- Patent number 6,904,673
- Issue date Jun 14, 2005
- International Business Machines Corporation
- Claude Blais
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 6,739,497
- Issue date May 25, 2004
- International Busines Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20060290008
- Publication date Dec 28, 2006
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20050224973
- Publication date Oct 13, 2005
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20040180469
- Publication date Sep 16, 2004
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20030209590
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20020195707
- Publication date Dec 26, 2002
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS

Pierre Langevin

Person

Patents Grantslast 30 patents

SMT passive device noflow underfill methodology and structure

Extension of fatigue life for C4 solder ball to chip connection

SMT passive device noflow underfill methodology and structure

Extension of fatigue life for C4 solder ball to chip connection

Control of flux by ink stop line in chip joining

SMT passive device noflow underfill methodology and structure

Patents Applicationslast 30 patents

SMT passive device noflow underfill methodology and structure

Extension of fatigue life for C4 solder ball to chip connection

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure

Extension of fatigue life for C4 solder ball to chip connection